Sn99.3Cu0.7 Tin Copper Alloy Bar Silver Free Solder

Sn99.3Cu0.7 tin copper alloy silver free bar solder BBIEN LF-03 Sn99.3Cu0.7 lead free alloy wave soldering bar,which is a silver free tin bar.Sn99.3Cu0.7 solder stick/bar is a eutectic Tin/Copper Sn/Cu alloy with controlled metallic dopants to control the grain structure within the solder joint,and to minimize the dissolution of copper into the solder pot.LF-03 Sn99.3Cu0.7 tin copper lead free wave soldering bar virtually eliminates the occurrence of common defects such as icicling and bridging.The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.

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Details

Product Details

Sn99.3Cu0.7 tin copper alloy bar silver free solder

BBIEN LF-03 Sn99Cu0.7 tin copper silver free high temperature wave soldering is a silver-free and lead-free solder according to ISO certificate which can replace eutectic or almost eutectic tin/silver/copper alloys. With this alloy, up to 90% of the cost proportion of silver can be reduced with almost identical processing characteristics.

Its melting point is 227 degree Celsius, usage for high technical electronics wave soldering.

Specifications

Product Type

Solder bar Sn99.3Cu0.7

Brand

BBIEN

Material

Tin-copper

Composition

Sn,Cu

Melt point

227 degree Celsius

Using

Match with solder flux for wave soldering

Application

Metal soldering,electronics

Density (g/m^3)

7.35

Bar/Stick size

32*2.0*1.8cm

Weight

Appox 0.9kg/pc

Type

High temperature solder bar

Place of origin

Made in China

Certificate

SGS

Keyword

Tin silver copper lead free oxidation resistance solder bar

Tin copper silver free lead free solder bar

Solder bar Sn99.3Cu0.7

Features & Benefits

Benefits:

 Lowers Total Cost of Ownership due to the lower material cost, high yields and low dross generation.

Gives very good solderability due to the fast wetting speed.

 Gives very good drainage and hence lower levels of bridges due to the formulation containing Silver.

Delivers good performance across a range of flux technologies.

The proprietary Vaculoy process is a highly effective method for removing included oxides from solder.

This is extremely important because included oxides generate excessive drossing and increase the viscosity of the solder. Solder with higher viscosity can result in increased soldering defects (i.e. solder bridging).

Features:

· Copper Dissolution Rate – Low copper dissolution rate, reduced solder-pot maintenance and improved bath life.

· Wetting Speed – 0.75 seconds typical wetting speed compares to SnCu0.7 at 0.65 sec and superior to Sn99.3/Cu0.7 base alloys at 1.0 sec.

· Flat Uniform Deposits – less thickness variance than Sn63/Pb37

· Lowers Total Cost of Ownership due to the lower material cost, high yields and low copper dissolution rates.

· Gives very good solderability due to the fast wetting speed.

· Compatible with all assembly SAC (Sn/Ag/Cu) and Sn/Cu based alloys SACX, SAC305 etc.

· Excellent shelf life and ultimate solderability – will improve hole fill on multiple reflow boards.

Melting Point (227°C)

Excellent Fatigue Resistance –

Compatible with all Flux Types

 Excellent Solder Joint Reliability

Application

Usual electronic component, PCB soldering; copper plate boards.

The use of BBIEN LF-03 Sn99.3Cu0.7 tin-copper wave soldering bar as wave solder requires a solder bath temperature of approx. 225-280 °C; this alloy can also be processed at higher temperatures for selective soldering. The use of inert gas means a significant extension of the process window. The wetting of the solder is made easier and on exit from the wave, no excess solder remains attached to the components.

Storage and Shelf Life

The shelf life of solder wire is based on the chemistry of the flux core and the protective alloy covering of the wire.

When stored in a dry, non-corrosive environment between 10°C-40°C (50-104°F), the shelf life of wire may be nearly indefinite. The expiration date determined by the date of manufacture printed on the product and Certificate of Analysis will represent the manufacturer’s warranty period which is the time frame where in BBIEN will replace defective product.

Low temperature Sn-Bi and Sn-Bi-Ag solder wires with alloys wire have a 2 year warranty from the date of manufacture.

All other alloys have a 2 year warranty from the date of manufacture.

Packing information

BBIEN LF-03 Sn99.3Cu0.7 silver free solder bar is available in 0.82~0.93 trapezoidal bars to easily distinguish it from traditional rectangular tin-lead bars.

Technical Datasheet

BBIEN LF-03 Sn99.3Cu0.7 tin copper alloy silver free bar solder

BBIEN LF-03 Sn99.3Cu0.7 silver free Sn/Cu soldering bar is a lead-free solder according to ISO9001:2008 to eliminate tin-lead alloys in all processes of electric and electronic manufacturing. The use of Ecoloy TC guarantees that lead-free assemblies can be produced according to WEEE and RoHS.

TECHNICAL DATA

BBIEN TL-03 SN99.3Cu0.7 bar solder complies with all requirements of RoHS. Directive (Article 4.1 of the European Directive 2011/65/EU). Alloy pecification for Maximum Lead (Pb) Content = 0.05%

Material Property

Units

Sn99.3Cu0.7

Solidus

Celsius

227

Liquidus

Celsius

229

Hardness

HV

9.4

Density

g/cc

7.30

Specific Heat Capacity

@100 ℃

0.198 J/g/ ℃

Thermal Expansion Coefficient

(30 - 100 ℃) µm/m℃

23.8

(100 - 180  ℃) µm/m ℃

24.3

Toughness

J

51.2

Tensile Stress

MPa

42.0

Tensile Strain

%

7.6

Yield Stress

MPa

33.4

Elongation

%

33.1

Recommended Wave Soldering Process Setting

Wave Configuration

Process Parameter

Suggested Process Settings

Single Wave

Pot temperature

255 - 270 Celsius (491 - 518 F)

Conveyor speed

1.0 - 1.5 m/min (3.3 - 5 ft/min)

Contact time

2.3 – 3.5 seconds

Wave Height

1/2 to 2/3 of board thickness

Dross removal

Once per 8 hour run time

Copper Check

Every 8,000 boards until 40,000

Dual Wave

Pot temperature

255 - 270 Celsius (491 - 518 F)

Conveyor speed

1.0 - 1.5 m/min (3.3 - 5 ft/min)

Contact time

3.0 - 4.5 seconds

Wave Height

1/2 to 2/3 of board thickness

Dross removal

Once per 8 hour run time

LF-03 SN99.3Cu0.7 Wave Soldering Bar Impurity

Please find below a list of recommended action levels for wave solder bath impurities. For information of specificaction plans to bring your solder bath back to an acceptable condition please contact your local sales office.

Element

ACTION

Levels

Notes

Sn

BAL

No Action level.

Pb

0.07

RoHS Directive 2011/65/EU states a maximum Lead content of

As

0.03

Levels greater than 0.03% can cause de-

Cu

1.00

SnCu0.7 is tolerant to copper levels up to 1.0%, SnCX Plus 00 copper free should be added to maintain copper levels. Levels above 1.0% may cause more bridging

Bi

0.20

Lead Free alloys are tolerant to Bi up to 1.0%, however if levels above 0.20% are detected this some contamination issues that should be

Zn

0.003

Levels greater than 0.003% may cause higher levels of bridging and icicling and a greater level of oxidation in the solder

Fe

0.02

Greater than 0.02% Iron can be an indicator of pot erosion and may cause gritty joint formation and the formation of FeSn2 IMC needles that can cause bridging.

Ag

0.50

Silver levels of 4% are used in some SAC alloys, however if the levels in SnCX rise above 0.5% then investigations should be held to establish the cause. Solderability should not be

Sb

0.20

Lead Free alloys are tolerant to Sb up to 1.0%, however if levels above 0.20% are detected this some contamination issues that should be

Ni

0.05

Levels greater than 0.04% may start to slow the wetting speed and could affect the hole fill If process performance is OK then levels up to 0.05% are OK.

Cd

0.003

RoHS Directive 2011/65/EU states a maximum Cadmium content of 0.01%. Levels of 0.003% may higher level of bridging and

Al

0.002

Levels greater than 0.002% may cause higher levels of bridging and icicling and a greater level of oxidation in the solder

Au

0.1

At levels above 0.1% there may be some problems with joint strength.

Feature

BBIEN LF-03 Sn99.3Cu0.7 tin copper alloy silver free bar solder

BBIEN LF-03 Sn99.3Cu0.5 silver free tin copper alloy bar solder compares favorably to other low-cost, lead-free alloys of tin and copper in terms of wetting and flow characteristics.

Sn-Cu alloy compound solder bar advantage

■ Low cost, lead-free alloy

■ Bright, smooth solder joints with no visible shrinkage effects

■ Excellent through-hole penetration and topside fillet

■ Low dissolution of copper from boards and components into solder pot

■ Eutectic alloy  20% Lower dross rate than Sn63Pb37 in laboratory test

■ Less corrosive to solder pots than SAC305

As with all BBIEN metals bar solder, BBIE’S proprietary manufacturing process is used to remove certain impurities, particularly oxides. The product is further enhanced with the addition of other elements designed to further improve alloy physical and mechanical properties, reduce drossing, increase wetting speed and force and improve joint reliability.

Features & Benefits

·  Reliability – Comparable to silver bearing alloys (i.e. SAC305) and other enhanced Sn99.3Cu0.7 alloys in thermal fatigue resistance, lap shear and pin pull performance.

·  Yield – Excellent production yields. Outperforms Sn99.3Cu0.7 based materials.

·  Copper Erosion – Low erosion in long, hot exposure soldering process.

·  Dross Generation – Lowest in class due to the Vaculoy process in conjunction with the addition of a dross reducing agent.

·  Solder Fillet Surface – Smooth and bright with no surface crack

·  Lowers Total Cost of Ownership due to the lower material cost, high yields and low copper dissolution rates.

·  Gives very good solderability due to the fast wetting speed.

·  Reduces erosion of copper plating during rework which improving assembly reliability.

·  Friendlier and less aggressive to solder pot material as compared to silver-bearing alloys.

·  Delivers good performance across different soldering processes.

The proprietary Vaculoy process is a highly effective method for removing included oxides from solder. This is extremely important because included oxides generate excessive drossing and increase the viscosity of the solder. Solder with higher viscosity can result in increased soldering defects (i.e solder bridging).

Advantage And Service

BBIEN LF-03 Sn99.3Cu0.7 tin copper alloy silver free bar solder

Products Advantage

High temperature no clean wave solder bar LF-03 BBIEN Sn99.3Cu0.7 offers excellent solderbility,wettibility and reliability among Pb free solder wire,it is available in a wide product lineup according to the required soldering temperature.

LF-03 BBIEN Sn99.3Cu0.7 tin-copper silver free no clean high temperature solder bar can be not only applied to tradional electronics pcb, electronics soldering,but also its application for some new hi-tech industry, semiconductor.LED,aerospace,automotive.

LF-03 BBIEN Sn99.3Cu0.7 its 227 degree Celsius melting point and RoHS standard Pb free tin based soldering bar can be packaged 20kg per carton which is used for both hands soldering and wave soldering technique.

Very good constant flow and wetting,clear and transparent residues

•Lowers Total Cost of Ownership due to the lower material cost,high yields and low dross generation.

•Excellent mechanical reliability.

•Provides very good solderability due to the fast wetting speed.

•Reduces erosion of copper plating during rework which improving assembly reliability.

•Friendlier and less aggressive to solder pot material as compared to silver-bearing alloys.

•Delivers good performance across different soldering processes.

Packing information:

10-20kg per carton Size of Carton:36*26*18cm

MOQ:30kg

OEM can be discussed,we will use our own label if customers have no other requirement.

Thanks to BBIEN long-term unremitting R&D for solder technique,until now,BBIEN have the following high-tech solder product for different lead free alloy.

No clean lead-free solder

melting point°C

Tensile strength

elongation reat%

expansion rate%

Diameter

Application

Solder wire alloy

Solder bar/block alloy

Solder paste alloy

Solder powder alloy

Sn99.3Cu0.7

227

30

45

70

≥0.1mm

low cost,the most commonly used;

Lead-free solder for general welding

yes

yes

yes

yes

Sn96.5Ag3.0Cu0.5

217

40

58

78

≥0.1mm

high cost,relatively bright spot;

high performence Can be excellent for demanding welding

yes

yes

yes

yes

Sn99.0Ag0.3Cu0.7

Sn64Bi35Ag1

189

40

50

70


SMT,PCB

yes

not

yes

yes

Sn62Pb36Ag2

189

38

54

75


SMT,PCB

yes

not

yes

yes

Sn42Bi58

138

38

50

75

≥0.5mm

High cost

yes

not

yes

yes

Certificates available

BBIEN can share the datasheet for our product to our clients.

Certificates of compliance,SGS,ISO and COA,MSDS,are available.

We are tyring to make our product quality system more and more complete,BBIEN also appreciate your precious suggestion.

Both pre-sale and after-sale,BBIEN have skilled person to follow-up our client,reply answer for reasonable price,relevant quality standard,products data informations,shipping for your questions skillfully, quickly, technical support is available.

Shipping Advantage

Mutiple-transportation oversea shipping ways by ari,by sea,by train and truck road way ensuring the shipment can arrive at destination all around the world safety,quickly and efficiently.

Shipment can be deliveried once placing order 2 to 10 working days.

Shipment will be regular go through local custom and its warehouse,BBIEN has own specialized shipping team and operators agent all over the world.

Service

When you send us message,BBIEN will feedback you general within 2 working hours.Our customer service or sales person will be match with you above 10-24hours.And solve your problem on solder products.

OEM is available according to your own logo.

Normal RAQ

1.Do I need to pay the charge for sample?

We offer the small free sample for testing,but the courier charge should be paid by your side.

2.How about your product quality,guaranteed?

Our products through strict quality control and inspection before leave factory,and has

passed the SGS.

3.What is your delivery time?

2-3days for delivery sample

2-3days for standard goods in stock

5-7days for normal order

7-12days for customize order

4.Any other special metal items that you make too?

We produce Zn wire,Sn wire,Mo wire,Indium wire;

We still make special metal alloy:e.g.,Sn-Bi,Ag-Al,Sn-Sb,Sn-Ag,

Ge metal;In metal etc

Payment way:

A variety and flexible of payment terms,T/T,western union,paypal,L/C can be acceptable.

Others:

Prodution ability:6tons each day for normally solder wire diameter above 1.0mm,packing 1kg/spool

Delivery time:within 7working days after confirming payment infos.

Why choose us?

*We are the manufacturer of solder items,special metal alloy, you can buy the suitable products you need at reasonable prices.le

*Our customer service personnel will provide you with our competitive quotation as well

as expedite your orders&provide you with any assistance you may require.

*Sales engineers are available to offer help recommending the most suitable products for your application and 

solve problems once you find problem to use our products.

*We can accept OEM or ODM,use your brand name and logo on the solder reel!

*Promptly delivery and small sample order is available.

Return back to society

BBIEN also participates public benefit activities,return back to society.We support and want to create a environmental friendly society together with people.We also try our best to help someone who need us.

BBIEN Technology is one of the professional manufacturers and suppliers of sn99.3cu0.7 tin copper alloy bar silver free solder. We have professional workers who have consummate skills producing high quality products in our factory. Welcome to buy our discount and low price sn99.3cu0.7 tin copper alloy bar silver free solder made in China. Pricelist and quotation consultation are available if you need.

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