High temperature solder bar Sn99Ag0.3Cu0.7

Sn99Ag0.3Cu0.7 high melting bar solder BBIEN LF-04 Sn99Ag0.3Cu0.7 high temperature wave soldering bar(Sn99Ag0.3Cu0.7)is a low-silver,lead-free solder according to ISO certificate which can replace eutectic or almost eutectic tin/silver/copper alloys.With this alloy,up to 90%of the cost proportion of silver can be reduced with almost identical processing characteristics. Its melting point is 227 degree Celsius,usage for high technical electronics wave soldering.

Details

BBIEN LF-04 Sn99Ag0.3Cu0.7 high quality melting solder bar

Sn99Ag0.3Cu0.7 solder bar description

BBIEN LF-04 SACX0307(Sn99Ag0.3Cu0.7) is a antioxidant lead-free alloy wave soldering bar that contains 99 % tin, 0.3% silver, and 0.7% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, BBIEN’s SACX0307 bar solder offers far superior fluidity as compared to other alloys and makes of bar, resulting in excellent flow. BBIEN’s SACX0307 tin-silver-copper alloy bar solder also produces less dross than other bar solder, wets well, provides superior joint strength, and offers superior copper dissolution rates. BBIEN’s SACX0307 bar solder is alloyed in the proprietary Electropure™ method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow and reducing bridging during soldering. SACX0307 may be used with most existing equipment, processes, coatings, and flux chemistries.

Technical Datasheet

Specifications

Product Type

Solder bar Sn99Ag0.3Cu0.7

Brand

BBIEN

Material

Tin-Silver-Copper alloy

Composition

Sn,Ag,Cu

Melt point

227 degree Celsius

Using

Match with solder flux for wave soldering

Application

Metal soldering,electronics

Density (g/m^3)

7.35

Bar/Stick size

32*2.0*1.8cm

Weight

Appox 0.9kg/pc

Type

High temperature solder bar

Place of origin

Made in China

Certificate

SGS

Keyword

Tin silver copper lead free oxidation resistance solder bar

SACX0307 lead free solder bar

Solder bar SACX0307

BBIEN is one of suppliers who have this difficult technical to make this kind of high temperature

BBIEN is one of suppliers who have this difficult technical to make this kind of high temperature oxidation resistance solder bar.We also got the approval of RoHS and REACH for lead free solder bar ISO9001 system of management and testing system reach the international standard.

Temperature Requirements: Wave soldering pot temperature of 265° -270°C (509° -518°F). Refer to the flux data sheet for specific pre-heat instructions.

Physical Properties:

Specific Gravity: Approx. 7.33~7.40 Melting Temperature: 217° -227°C 

Metal Property

Units

Vaculoy Sn99Ag0.3Cu0.7

Solidus

Celsius

227

Liquidus

Celsius

228

Hardness

HV

14.1

Density

g/cc

7.33

Elongation at failure (%)

Mean

21.8

Std Dev

8.8

Thermal Expansion Coefficient

-5

(30 - 100C)/C x 10

1.79

-5

(100 - 150C)/C x 10

2.30

Silver Content

%

0.3 +0.15/-0.05

Copper Content

%

0.70 +/-0.1

Lead Content

%

Max 0.07%

Recommended Process Settings

Wave Configuration

Process Parameter

Suggested Process Settings

Single Wave

Pot temperature

255 - 265°C (491 - 509°F)

Conveyor speed

1.0 - 1.5 m/min (3.3 - 5 ft/min)

Contact time

2.3 - 2.8 seconds

Wave Height

1/2 to 2/3 of board thickness

Dross removal

Once per 8 hour run time

Copper Check

Every 8,000 boards until 40,000



Dual Wave

Pot temperature

255 - 265°C (491 - 509°F)

Conveyor speed

1.0 - 1.5 m/min (3.3 - 5 ft/min)

Contact time

3.0 - 3.5 seconds

Wave Height

1/2 to 2/3 of board thickness

Dross removal

Once per 8 hour run time

Copper Check

Every 8,000 boards until 40,000

These are general guidelines which have proven to yield excellent results; however, depending upon your

equipment, components, and circuit boards, your optimal settings may be different. In order to optimize your

process, it is recommended to perform a design experiment, optimizing the most important variables (i.e.

amount of flux applied, conveyor speed, topside preheat temperature, solder pot temperature and board

orientation, etc…).

Recommended AC Tion Levels for Wave Solder Impurities  

Alloy Coposition: Sn: Balance Ag: 0.3 ± 0.2 Cu: 0.7 ± 0.1

Impurity Contents

Please find below a list of recommended action levels for wave solder bath impurities. For information of specific action plans to bring your solder bath back to an acceptable condition please contact BBIEN sales office.

Element

ACTION Levels %

Notes

Sn

BAL

No Action level.

Pb

0.10

RoHS Directive 2011/65/EU states a maximum Lead content of 0.1%.

As

0.03

Levels greater than 0.03% can cause de-wetting.

Cu

1.0

SACX 0307 is tolerant to copper levels up to 1.0%, SACX 0300 copper free should be added to maintain copper levels. Levels above 1.0% may cause more bridging.

Bi

0.20

Lead Free alloys are tolerant to Bi up to 1.0%, however if levels above

0.20% are detected this indicates some contamination issues that should be investigated.

Zn

0.003

Levels greater than 0.003% may cause increased bridging and icicling, as well as, increased drossing rates in the solder bath.

Fe

0.02

Greater than 0.02% Iron can be an indicator of pot erosion and may cause gritty joints and the formation of FeSn2 IMC needles that can cause bridging.

Ag

1.0

Silver levels of 4% are used in some SAC alloys, however if the levels in

SACX 0307 rise above 1.0% then some investigations should be held to

establish the cause.

Sb

0.20

Lead Free alloys are tolerant to Sb up to 1.0%, however if levels above

0.20% are detected this indicates some contamination issues that should be investigated.

Ni

0.05

Levels greater than 0.05% may start to slow wetting and may reduce hole fill.

Evaluate soldering performance if levels exceed 0.05%. Locate and

eliminate source of high Ni levels.

Cd

0.003

RoHS Directive 2011/65/EU states a maximum Cadmium content of 0.01%.

Levels of 0.003% may cause higher level of bridging and icicling.

Al

0.002

Levels greater than 0.002% may cause higher levels of bridging and icicling

and a greater level of surface oxidation in the solder bath.

Au

0.1

At levels above 0.1% there may be some problems with joint strength.

Features&Benefits

Benefits:

Lowers Total Cost of Ownership due to the lower material cost,high yields and low dross generation.

Gives very good solderability due to the fast wetting speed.

Gives very good drainage and hence lower levels of bridges due to the formulation containing Silver.

Delivers good performance across a range of flux technologies.

The proprietary Vaculoy process is a highly effective method for removing included oxides from solder.

This is extremely important because included oxides generate excessive drossing and increase the viscosity of the solder.Solder with higher viscosity can result in increased soldering defects(i.e.solder bridging).

Features:

· Copper Dissolution Rate–Low copper dissolution rate,reduced solder-pot maintenance and improved bath life.

· Wetting Speed–0.75 seconds typical wetting speed compares to SAC0307 at 0.65 sec and superior to Sn99.3/Cu0.7 base alloys at 1.0 sec.

· Flat Uniform Deposits–less thickness variance than Sn63/Pb37

· Lowers Total Cost of Ownership due to the lower material cost,high yields and low copper dissolution rates.

· Gives very good solderability due to the fast wetting speed.

· Compatible with all assembly SAC(Sn/Ag/Cu)based alloys SACX,SAC305 etc.

· Excellent shelf life and ultimate solderability–will improve hole fill on multiple reflow boards.

Melting Point(217°C-228°C)

Excellent Fatigue Resistance–

Compatible with all Flux Types

Excellent Solder Joint Reliability

Application

Usual electronic component,PCB soldering;copper plate boards.

The use of BBIEN LF-04 Sn99Ag0.3Cu0.7(SACX0307)wave soldering bar as wave solder requires a solder bath temperature of approx.225-270°C;this alloy can also be processed at higher temperatures for selective soldering.The use of inert gas means a significant extension of the process window.The wetting of the solder is made easier and on exit from the wave,no excess solder remains attached to the components.

Storage and Shelf Life

The shelf life of solder wire is based on the chemistry of the flux core and the protective alloy covering of the wire.

When stored in a dry,non-corrosive environment between 10°C-40°C(50-104°F),the shelf life of wire may be nearly indefinite.The expiration date determined by the date of manufacture printed on the product and Certificate of Analysis will represent the manufacturer’s warranty period which is the time frame where in BBIEN will replace defective product.

Low temperature Sn-Bi and Sn-Bi-Ag solder wires with alloys wire have a 2 year warranty from the date of manufacture.

All other alloys have a 2 year warranty from the date of manufacture.

Packing information

BBIEN LF-04 Sn99Ag0.3Cu0.7(SACX0307)silver solder bar is available in 0.82~0.93 trapezoidal bars to easily distinguish it from traditional rectangular tin-lead bars.

Checkout and payment:

After Auction Close,you can go ahead and checkout with bank system.We do not offer combine payment and discount, since items might dispatch from our different warehouse.Make sure you file correct shipping address during checkout,and you will be guid to Payment link.You will be able to pay through our bank account by 100%T/T advanced L/C at sight is acceptab

Shipping way:

We have a cooperation with big express company,such as CHINA POST(EMS),TNT,DHL,FEDEX,UPS;

We also connect with SF express inland market,while the delivery time is short.During shipping,we will follow up within 24 hours,and report the relevant process scheduling for you.

Exported Situation

BBIEN LF-04 SACX0307 lead free silver solder bar have been exported to Korea,Autralia,Japan,Canad,Saudi-Arab,UAE.We are highly appreciated your kindly inquiry and feedback to BBIEN,and cooperate in the future.

Products Photos

BBIEN Technology is one of the professional manufacturers and suppliers of sn99ag0.3cu0.7 high melting bar solder. We have professional workers who have consummate skills producing high quality products in our factory. Welcome to buy our discount and low price sn99ag0.3cu0.7 high melting bar solder made in China. Pricelist and quotation consultation are available if you need.

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