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Set the solder paste reflow temperature profile
Sep 20, 2016

Correct temperature curves will ensure high-quality welded solder points.

One: testing methods

Using surface mount components of printed circuit board (PCB) Assembly, to get high quality solder joints, an optimized reflow profile is one of the most important factors. The temperature on the temperature curve is applied to the circuit Assembly functions of time, when drawing in the Cartesian plane, return at any given time in the process, represent a specific point on the PCB temperature on formation of a curve. Several parameters influencing the shape of the curve, one of the most critical is the conveyor speed and temperature settings in each district. Speed decision Board exposure duration set for each sector temperatures, increase the duration to allow more time for the circuit Assembly close to the temperature setting of the area. Each district the sum spent the duration of the total processing time.

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