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Single-sided SMD technology
Sep 21, 2016

Single Assembly:

Incoming inspection => screen printing of solder paste (adhesive) => patch => drying (cure) => for reflow soldering => cleaning => detect => repair

Double-sided Assembly:

A: the receiving material inspection, => a surface screen printing of PCB solder paste (adhesive) => patch b surface screen printing of PCB solder paste (adhesive) => patch => dried => reflow soldering (preferably only on b => cleaning => detect => repair).

B: material testing => a surface screen printing of PCB solder paste (adhesive) => patch => drying (cure) =>A reflow cleaning =>-= => PCB b point adhesive curing =>B => patch => => cleaning => detect => for wave soldering rework)

This process applies in PCB reflow soldering a b wave. On the b side of the PCB Assembly SMD only SOT or SOIC (28) pins below, this process should be used.


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