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BBIEN supplies Sn-Ag-Cu alloy Lead-Free High-temperature Solder Paste
Nov 15, 2018

BBIEN New Sn-Ag solder paste

  • Alloy:SAC305,SAC0307,SnAg3.5

  • Trademark:BBIEN

  • Packing:500G/Bottle, 10KG/BOX;syringe packing 100g.200g

  • Origin:Shenzhen

Product Description
Lead-free high temperature solder paste
This series solder paste melting point is 220 centigrade, processing temperature requiring between(240-245)centigrade, time(120-180sec) which is the fittest solder material. It has high resistance capability and excellent printing and the leftover on surface needn't cleaning when return welding, no halogen compound residue which in accordance with environmental protetion forbidden material standard and has improved all kinds of problems such as continuous printing, splashing flux and too high preheat temperature exixt in tradition lead-free solder paste.

Alloy element:
1. SnCuAg0.3: (Sn)99± 0.5%, (Cu)0.7± 0.05%, (Ag)0.3± 0.05%
2. SnCuAg3.0: (Sn)96.5± 0.3%, (Cu)0.5± 0.02%, (Ag)3.0± 0.2%
Alloy powder shape: 25-45um;25-38um;15-25um;5-15um;2-10um
Flux contents: 11± 0.5%
Melting point: 220 centigrade
Package: 500g/bottle;100g 200g per syringe

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