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BBIEN supplies type7 low temperature solder paste Sn42Bi58
Nov 20, 2018


BBIEN supplies type7 low temperature solder paste Sn42Bi58


Basic Info
  • Model NO.:Sn42Bi58 type7(5~12micron powder size)

  • state:Paste

  • pH:Acidic

  • Type:low temperature soldering paste

  • Melting Point:138

  • Chemical Composition:42%Sn,58%Bi

  • Function:Soldering Technique

  • Application:Electronics Welding

  • Applicability:LED Light, Kinds of SMT, PCB, Pad etc

  • Quality:High Quality

  • Trademark:BBIEN

  • Origin:Shenzhen, China

Product Description
Alloy: Sn42-Bi58
Alloy: Tin, Bi solder paste
Validity of slder paste: 6moths
Weight: 500 grams/bottle, 10kg/CTN;syringe pasing 100g,200g are also avaliable.

Introduction:

Type7(5~12micron powder size) Sn42Bi58 Bi series is designed to meet requirements for reliable solder joints in SMT PC board assemblies.This no clean soldering cream is a type of low temperature solder paste,which its melting point is just 138 . This formula was designed to have a wider process window and better compatibility with LED surfaces. This formulation exhibits long print life in continuous printing operations. Residue can be removed using. It is RoHS-compliant and increases production yields with its unparalleled lot-to-lot and stencil printing consistency, and offers superior print performance characteristics, including excellent wetting, strong activity, ideal viscosity.  Application:The Sn42Bi58 Bi series is designed to meet requirements for reliable solder joints in SMT PC board assemblies.

Characteristic of type7(5~12micron powder size):
1. Broad backflow craft window, perfect reflow soldering effect.
2. May print high speed, the print speed may reach 150mm/sec.
3. The precise printing, the printing gap may slightly to 0.25mm.
4. The non-brittleness remains transparently, but online probe examination.

BBIEN Solder paste is specially the SMT production line design manufacture non-lead exempts the clean tin paste. The its welding flux changing system is suitable after the special compound design for the thin spacing prints high speed, can achieve the nearly perfect reflow soldering effect. The Lead-free solder paste can in the air furnace the reflow soldering, can also in the nitrogen the backflow, after the backflow, does not need to clean.

Lead-free solder paste unique active system, guaranteed that eliminates each kind of reflow soldering flaw, simultaneously can guarantee the soldering paste long-term stability. Characteristic: Broad backflow craft window, perfect reflow soldering effect. May print high speed, the print speed may reach 150mm/sec. The precise printing, the printing gap may slightly to 0.25mm. The non-brittleness remains transparently, but online probe examination. The working conditions are loose, may print under 20-32° C the room temperature environment.

Sort

Chemical composition (wt.%)

Sn

Bi

Sb

Pb

Fe

Al

Cd

Sn42-Bi58

42

58

<0.02

<0.01

<0.02

<0.002

<0.003

Photos:





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