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Flux The Main Ingredients And Functions:
Sep 20, 2016

A, Activator (ACTIVATION): the composition is mainly to remove PCB copper pad surface of oxide materials and components welded parts, with lower surface tension effects of Tin and lead;

B, thixotropic agent (THIXOTROPIC): the composition is mainly adjusting the viscosity of the solder paste and printing performance, plays in printing to prevent smearing and adhesion phenomena;

C, resins (RESINS): the composition is mainly to increase the adherence of solder paste, and protection from and prevention of oxidation of PCB after soldering again; the component parts plays an important role;

D, solvent (SOLVENT): this ingredient is a flux-component solvent, solder paste mixing process regulation uniform, has some influence on life of solder paste;


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