179 Degree Tin Bismuth Silver Solder Paste Sn64Bi35Ag1

BBIEN’S LF-03 Sn64Bi35Ag1 bismuth Pb free reflowing solder paste is middle temperature type,its melting point is 179 degree Celsius,generally, Sn64Bi35Ag melting point is not stable, its range from 138degree Celsius to 179degree Celsius. Sn64Bi35Ag is a between traditional and new generation paste family improving upon the industry standard with excellent printing stability, enhanced heat resistance, reduced flux splattering, head-in-pillow elimination and tack power. BBIEN can supply type3,type4,type5,type6 and type7 jet solder paste 100g per syringe for dispensing technique and stencil 50g,500g jar. Exported countries: Saudi-Arab, Egpe,Germany, South Korea, Russia, America, UAE,Brazial,India,Iran

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Details

Product Details

179degree tin bismuth silver solder paste LF-03 Sn64Bi35Ag1

Brief introduction for LF-03 Sn64Bi35Ag1 Bi solder paste

BBIEN LF-03 Sn64Bi35Ag1 is a RoHS standard solder paste, lead-free solder paste which is made from world class powder for enhanced solder ability, which contains <500 ppm of lead, guaranteed. BBIEN is your innovative source for SynTECH-LF, a unique lead-free, no-clean solder paste formula made with proprietary synthetic poly-adduct components.

LF-03 Sn64Bi35Ag1 tin-bismuth-silver no clean solder paste is newly developed for dispensing excellence, flux paste is compliant with a wide range of applications. Compliant with various heating methods such as; reflow furnaces, rapid heating laser and hot air convection.

Cleaning

BBIEN LF-03 Sn64Bi35Ag1 Pb-free solder paste is designed for no-clean applications, however the paste flux can be removed if necessary by using a commercially available flux residue remover. Automated stencil cleaning is best performed using a dry wipe followed by a vacuum wipe. If using a wet wipe, isopropyl alcohol or a solvent-based commercially available cleaner should be used. IPA and other solvent-based cleaners are also acceptable for manual stencil cleaning

Storage and Handling Procedures

Refrigerated storage will prolong the shelf life of solder paste.

Solder paste packaged in cartridges should be stored tip down.

Storage Conditions(unopened containers)

Shelf Life temperature<10°C   6 months

Solder paste should be allowed to reach ambient working temperature prior to use. Generally, paste should be removed from refrigeration at least two hours before use. Actual time to reach thermal equilibrium will vary with container size. Solder paste

temperature should be verified before use. Jars and cartridges should be labeled with date and time of opening.

Packaging

BBIEN LF-03 Sn64Bi35Ag1 Pb-free RoHS standard solder paste is currently available in 500g jars or 50g

100g tube,Jet/syringe/cartridges packaging for enclosed print head systems is also readily available. Alternate packaging options may beavailable upon request.

Out packing carton size:36*28*30cm ,N.W 10kg

Production Capacity: more than 2tons per week

BELLCORE AND J-STD TESTS & RESULTS

BELLCORE AND J-STD TESTS & RESULTS

Test

Result

Test

Result

J-STD-004A (IPC-TM-650)


J-STD-005 (IPC-TM-650)


Flux Type (per J-STD-004A)

ROL0

Typical Solder Paste Viscosity

Malcom (10rpm)

1300 poise

Flux Induced Corrosion

(Copper Mirror)

Type L

Slump Test

Pass

Presence of Halide

Oxygen Bomb followed by

ion chromatography

<50ppm Br -

<50ppm Cl -

Solder Ball Test

Pass

Typical Tackiness

35g

Wetting Test

Pass

SIR

Pass

BELLCORE GR-78


SIR

Pass

Electromigration

Pass

Application
Shenzhen bbien technology limited Sn64Bi35Ag1 silver Solder pastes are used in the assembly of printed circuit boards (PCBs) and SMT for a wide variety of applications, including hand-held electronic devices such as smart phones and tablets, computer motherboards, consumer electronic products, network servers, automotive systems, medical and military equipment and many others. 

Technical Datasheet

Recommended Reflow Profile for BBIEN LF-03 Sn64Bi35Ag1 Pb- free bismuth solder paste

Full Convection reflow method is most commonly used to reflow the LF-03 Sn64Bi35Ag1formula. The recommended convection reflow profile for 90 LF-03 Sn64Bi35Ag1 made with either the SnBiAg alloys is shown here.

 

Printing Parameters

Heat Rate

 Time for Reaching 110 ºC

 

Constent Temperature

110 - 138ºC

Peak

> 138°C

Cooling Rate

1-3 ºC/sec    

< 60—90s

60—100s

175 ±5ºC

< 30—60s

<4ºC / S

In addition,the righ speed rate PCB for reflowing process is 800~1000mm per minius.

Specification and chemistry component

Specification

Sn64Bi35Ag1

Appearance

Black tacky flux paste

Weight

500g/jar;100g/cartridge

physical characteristic

Solder paste

 Chemical composition (wt.%)

Sn

Bi

Ag

Pb

Fe

Sb

In

Cu

Zn

Al

As

Cd

Sn64-Bi35-Ag1

64±0.5

35±0.5

1±0.5

<0.01

<0.02

<0.001

<0.02

<0.05

<0.02

<0.001

<0.003

<0.002

Physical Speciality

 

Sort

(℃) 

Melting Point

 g/cm3

Spec. Gravity

 MPa

Tensile Strength

Sn64-Bi35-Ag1

139℃ 

8.9g/cm3

32HB

Feature

Features of BBIEN LF-03 Sn64Bi35Ag1 lead free tin solder paste

•Eliminates clogged apertures through advanced rheology

•Excellent wetting and no-clean

Excellent solderability to a wide variety of surface metalizations.

•High oxidation resistance

•Excellent soldering performance under high temperature and long reflow processes

Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features

Able to spread and wet using straight ramp or soak reflow profiles in air.

High spread/wetting lead free paste compatible with lead free alloys and surface finishes

High Reflow Yield with IPC Class II Voiding Performance when used to solder BGA components

Excellent wetting characteristics on all common surface finishes (including Entek HT OSP). JIS Spread 88.6% on Entek HT OSP.

Advantage And Service

BBIEN LF-03 Sn64Bi35Ag1 Solder paste Products Advantage

middle temperature no clean solder paste LF-03 Sn64Bi35Ag1 offers high solderbility,wettibility and reliability, it is available in a wide product lineup according to the required soldering temperature.

Due to sophisticated technical in Sn-Bi-Ag alloy,BBIEN can supply the thinnest size of type7(5~12micron) for LF-03 Sn64Bi35Ag1 no clean solder paste, normal size such as type6,type5,type4 and type3 are also available

LF-03 Sn64Bi35Ag1 silver no clean solder paste can be not only applied to tradional electronics pcb,smt reflowing soldering,but also its application for some new hi-tech industry, semiconductor.LED,aerospace,automotive.

LF-03 Sn64Bi35Ag1 middle temperature 179 degree Celsius solder paste can be packaged with jar 50,500g,which is used for stencil soldering;it can also be packed with 100g jet tube used for dispensing soldering.

.BBIEN is specialized in soldering industry from 2000, known as a experienced solder manufacturer,whose products are made in China,since then,BBIEN pays high attention to Research and Development,continuous technical innovation for lead free solder paste industry,until now,we accumulate much valuable experience,six senior solder paste engineers operate a specialized reflowing solder paste production.

Shipping Advantage

Mutiple-transportation oversea shipping ways by ari,by sea,by train and truck road way ensuring the shipment can arrive at destination all around the world safety ,quickly and efficiently.

Shipment can be deliveried once placing order 2 to 10 working days.

Shipment will be regular go through local custom and its warehouse,BBIEN has own specialized shipping team and operators agent all over the world.

Technical Advantage

BBIEN can share the datasheet for our product to our clients.

Certificate of compliance,SGS,ISO and COA,MSDS,are available.

We are tyring to make our product quality system more and more complete, BBIEN also appreciate your precious suggestion. 

Both pre-sale and after-sale,BBIEN have skilled person to follow-up our client,reply answer for reasonable price,relevant quality standard,products data informations,shipping for your questions skillfully,quickly,technical support is available.

Service

When you send us message,BBIEN will feedback you general within 2 working hours.Our customer service or sales person will be match with you above 10-24hours. And solve your problem on solder products.

OEM is available according to your own logo.

Return back to society

BBIEN also participates public benefit activities,return back to society.We support and want to create a environmental friendly society together with people.We also try our best to help someone who need us.

Payment way:

A variety and flexible of payment terms,T/T,western union,paypal,L/C can be acceptable.


BBIEN Technology is one of the professional manufacturers and suppliers of 179 degree tin bismuth silver solder paste sn64bi35ag1. We have professional workers who have consummate skills producing high quality products in our factory. Welcome to buy our discount and low price 179 degree tin bismuth silver solder paste sn64bi35ag1 made in China. Pricelist and quotation consultation are available if you need.

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