Type7 High Ag No Clean Solder Paste SAC305

High Ag no clean solder paste SAC305 Solder paste is a form of solder that is used in PCB,SMD,SMT assembly, and including prototype PCB assembly, especially when using reflow soldering techniques. BBIEN’s LF-01 lead free solder paste SAC305 is a type of high silver content lead free no-clean solder paste specifically formulated to accommodate the higher processing temperatures required alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. LF-01 lead free solder paste SAC305(Sn96.5Ag3.0Cu0.5) offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.

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Details

Product Details

Type7 high Ag no clean solder paste SAC305

BBIEN’S LF-01 SAC305(SN96.5Ag3.0Cu0.5) is a lead-free, no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. This product is also designed to enable consistent fine pitch printing capability, down to 180µm circle printed with 100µm thickness stencil.

Availability:

Available type:it is available in Sn96.5Ag3.0Cu0.5 type 3 powder mesh is normally recommended, but type4,type5,type6 and type7 are all skilled and available for this alloy solder paste.

Available packing:500g,50g per jar; 100g per syringe/tube

BBIEN’S LF-01 SAC305(SN96.5Ag3.0Cu0.5) solder paste is available for fine pitch applications with SnAgCu alloys in a similar melting range to the listed alloys,for specific packaging information.

BBIEN SAC305 silver solder paste is a synthetic poly-adduct designed to exceed requirements for reliable solder joints in SMT PC board assemblies. This paste was formulated to replace traditional rosin/resin based no-clean formulations with more reliable synthetic materials. The residue is pin probable for ICT inspection. Sn96.5Ag3.0Cu0.5 no clean solder paste does not require refrigeration if left at room temperature 23degree for 3 months and has a 8-12-month refrigerated (2-9degree) shelf life.

Storage, Handling, and Shelf Life:

Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity,reflow characteristics, and overall performance. BBIEN’S SAC305 should be stabilized at room temperature prior to printing. BBIEN SAC305 should be kept at standard refrigeration temperatures, 0-10°C (32-50°F). Please contact BBIEN,if you require additional advice with regard to storage and handling of this material. Shelf life is 6months from date of manufacture and held at 3~10°C (32-50°F).

Packing Details:
Packing could be classified as can/bottle packing and syringe packing type.
Each jar/bottle holds the solder paste is 500g;
Each syringe can load the solder paste is 100g
The packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.

Specification

Sn96.5Ag3.0Cu0.5 type7

Appearance

gray tacky paste

Weight

500g/jar or 100g/syringe;10kg/carton

Exported Countries:

Japan,South Korea,Russia,America,Germany,Mid-east countries,Brazial,India,Iran,Egype,Thailand.

Health & Safety:

This product, during handling or use, may be hazardous to health or the environment. Read the Material safety Data Sheet and warning label before using this product.

Application:

BBIEN’S SAC305 no clean solder pastes are used in the assembly of printed circuit boards (PCBs) for a wide variety of applications, including hand-held electronic devices such as smart phones and tablets, computer motherboards, consumer electronic products, network servers, automotive systems, medical and military equipment and many others.

Technical Datasheet

Type7 high Ag no clean solder paste BBIEN LF-01 SAC305

SHENZHEN BBIEN TECHNOLOGY CO.,LTD supplies SAC305 solder paste technical datasheet can be applied for both stencil jar packing and dispensing syringe tube packing solder type

Test Content--

Test Item

Test Result

Test Method

Copper Plate Corrosion Test

Pass

JIS-Z-3197, 8.4.1

Spread Test

> 75%

JIS-Z-3197, 8.3.1.1

Copper Mirror Test

Pass

IPC-TM-650, 2.3.32

Viscosity Test(25 °C,10rpm)

220 ± 30 Pa • s

JIS-Z-3284. Annex 6

Tackiness Test (gf)

> 130 (8hr)

JIS-Z-3284. Annex 9

Slump Test

Pass

JIS-Z-3284. Annex 7, 8

Solder Ball Test

Pass

JIS-Z-3284. Annex 11

--Reliability Test--

S.I.R. Test ◊

> 1×109 Ω , Pass

IPC-TM-650, 2.6.3.3

Electro Migration Test ♦

Pass

IPC-TM-650, 2.6.14.1

Test Conditions: 85 °C, 85% RH for 168 hrs ♦Test Conditions: 65 °C, 85% RH for 596 hrs
--Alloy Composition--

(Sn)

(Ag)

(Cu)

(Ni)

(Ge)

(Zn)

(Al)

(Sb)

(Fe)

(As)

(Bi)

(Cd)

(Pb)

REM.

2.8~3.2

0.3~0.7

0~0.01

0~0.01

0.001 MAX

0.001 MAX

0.05 MAX

0.02 MAX

0.03 MAX

0.10 MAX

0.002 MAX

0.05 M

Reflowing Profile:

LF-01 SAC305 solder paste REFLOW TIME PROFILE

Heating rate

the time required to 120 ºC

constant tem.
130 - 170ºC

peak tem.

> 220°C

cooling rate

1-3 ºC/sec

< 60—90secs

60—120secs

< 245 ±5ºC

< 40—80secs

<4ºC / S

Storage, Handling, and Shelf Life:
Refrigeration is the recommended optimum storage condition fortype7 SAC305 lead free solder pasteto maintain consistent viscosity,reflow characteristics and overall performance. SAC305 lead free solder pasteshould be stabilized at room temperature prior to printing. SAC305 lead free solder pasteshould be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact us if you require additional advice with regard storage and handling of this material. Shelf life is 6-10 months from date of manufacture when handled properly and held at 0-10°C (32-50°F).

Feature

Features of Type7 high Ag no clean solder paste SAC305

SAC305no clean solder paste offers high soldering reliability compared with the Sn-Pb series solder of the past and is available in a wide product lineup according to the required soldering temperature.

Long Stencil Life: consistent performance for at least 8 hours of continuous printing without addition of new paste

Long, High Tack Force Life: ensures high pick-and-place yields, good self-alignment

Wide Reflow Profile Window: allows best quality solderability of complicated, high density PWB assemblies in both air and nitrogen reflow, using ramp and soak profiles, as high as 220 to 240 degree Celsus

Reduced Random Solder Ball Levels: minimizes rework and increases first time yield

Excellent Coalescence and Wetting Performance: coalesced 180µm circle deposit, even at high soak profile environment

Supply type7(5~12micron mesh powder size) with high technique electronics soldering

Advantage And Service

Type7 high Ag no clean solder paste SAC305

Advantage And Service

Products Advantage

1) high Ag no clean solder paste SAC305 offers high soldering reliability compared with the

Sn-Pb series solder of the past and is available in a wide product lineup according to the required soldering temperature.

2) BBIEN solder factory pay high attention to Research and Development,continuous technical innovation for lead free solder paste industry,until now,we accumulate much valuable experience,six senior solder paste engineers operate a specialized reflowing solder paste production.

3) Due to sophisticated technical in Sn-Ag-Cu alloy,BBIEN can supply the thinnest size of type7(5~12micron) solder paste for SAC305 no clean solder paste, normal size such as type6,type5,type4 and type3 are also available.

4) Ag no clean solder paste LF-01 SAC305(Sn96.5Ag3.0Cu0.5) can be not only applied to tradional electronics pcb,smt reflowing soldering,but also its application for some new hi-tech industry, semiconductor.LED,aerospace,automotive.

5) LF-01 SAC305 no clean solder paste can be packaged with jar 50,500g,which is used for stencil soldering;it can also be packed with 100g joint syringe tube used for  dispensing soldering.

Technical Advantage

1) BBIEN can share the datasheet for our product to our clients.

2) Some certificate of compliance,SGS,ISO and COA,MSDS,are available.

3) BBIEN appreciate our clients and your valuable advice and suggestion,which will make our product and company better and better.

4) Both pre-sale and after-sale,BBIEN have skilled person to follow-up our client,reply answer for reasonable price,relevant quality standard,products data informations,shipping for your questions skillfully,quickly,technical support is available.

Shipping Advantage

1) Mutiple-transportation oversea shipping ways by ari,by sea,by train and truck road way ensuring the shipment can arrive at destination all around the world safety ,quickly and efficiently.

2) Shipment can be deliveried once placing order 2 to 10 working days.

3) Shipment will be regular and normal go through local custom and its warehouse,BBIEN has own specialized shipping team and operators agent all over the world.

Service

1) When you send us message,BBIEN will feedback you general within 2 working hours.Our customer service or sales person will be match with you above 10-24hours. And solve your problem on solder products.

2) OEM is available according to your own logo.

Payment way:

A variety and flexible of payment terms,T/T,western union,paypal,L/C can be acceptable.

BBIEN Technology is one of the professional manufacturers and suppliers of type7 high ag no clean solder paste sac305. We have professional workers who have consummate skills producing high quality products in our factory. Welcome to buy our discount and low price type7 high ag no clean solder paste sac305 made in China. Pricelist and quotation consultation are available if you need.

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