183 Degree No Clean Lead Solder Paste Sn63Pb37

183 degree no clean lead solder paste BBIEN TL-01 Sn63Pb37 BBIEN TL-01 Sn63Pb37 no clean tin lead solder paste its melting point is 183 degree Celsius was developed to meet the demands of tin lead soldering when lead free components are present in the circuit assembly.Like all BBIEN solder pastes,SN63PB37 leaded solder paste has excellent print volume repeatability to minimize variation in the print process.SN63PB37 minimizes print cyle times through high print speeds and extended number of prints between stencils under cleaning.Naormal type 3 no clean solder paste is made for Sn63/Pb37,type4,type5,type6 and type7 lead contain solder paste are also available.

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Product Details

183 degree no clean BBIEN lead solder paste TL-01 Sn63Pb37

Brief Description for Sn63Pb37 lead solder paste

BBIEN TL-01 Sn63Pb37 is a no-clean, air or nitrogen reflowable leaded solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste.Its excellent reflowing soldering result and bright soldering joints is highly appreciated by users. It is also belong to low temperature solder paste as its melting point is not high,just 183 degree Celsius.

BBIEN TL-01 Sn63Pb37 has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metalizations. BBIEN TL-01 Sn63Pb37 is also capable of stencil printing after downtimes of up to 90 minutes with an effective first print down to 20 mils. BBIEN TL-01 Sn63Pb37 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.

Feature of Sn63Pb37 lead solder paste

1) Fine Feature Capability: High print deposit volumes and low volume variability down to 12 mil (0.30mm) circle feature sizes.

2) Electrical Reliability: Exceeds the requirements of the IPC and Bellcore SIR electrical reliability tests.

3) Suitable for fine pitch applications such as 0.5 mm (20mil) pitch Flip-Chip and 0201 assembly.

4) Excellent response to pause performance, generating fewer defects due to start up.

5) High print speed, up to 150 mm/sec (6 inch/sec)

6) Excellent solderability on difficult to solder to components, i.e., PdAg

7) High activity on all substrates,including OSPs

8) Capable of 90-minute break times in printing

9) Excellent printing characteristics to 0.4mm (16 mil) pitch with Type 3 powder

10) High print speeds to 150 mm/sec (6in/sec)

Stable tack over 8+ hours Stencil life: 8+ hours (process dependent)

Scrap is reduced due to less paste dry out.Classified as ROL0 per J-STD-004B.Compliant to Bellcore GR-7

Availability

BBIEN TL-01 Sn63Pb37 leaded no solder paste no clean is commonly available in the Sn63Pb37 type 3 powder(25-45micron),type 4 mesh is recommended, but different powder particle size distributions type5,type6 and type7 solder paste are available for standard and fine pitch applications.

Health and Safety

This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet and warning label before using this product.

Cleaning for Sn63Pb37 lead solder paste

Lead solder paste Sn63Pb37 is a no-clean formula. The residues don’t need to be removed for typical applications. Although lead solder paste TL-01Sn63Pb37 is designed for no-clean applications, its residues can be easily removed using automated cleaning equipment (in-line orbatch) with a variety of readily available cleaning agents. Call BBIEN Technical Support for details.

Storage, Handling, and Shelf Life:

Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity,reflow characteristics and overall performance. HM531 should be stabilized at room temperature prior to printing. It should be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact us if you require additional advice with regard storage and handling of this material. Shelf life is 6 months from date of manufacture when handled properly and held at 0-10°C (32-50°F).

Packaging

BBIEN TL-01 Sn63Pb37 Pb solder paste is currently available in 500g jars or 50g jar,

100g tube,jet/syringe/cartridges packaging for enclosed print head systems is also readily available. Alternate packaging options may be available upon request.

Out packing carton size:36*28*30cm,N.W 10kg

Production Capacity: more than 2tons per week

Application
BBIEN Sn63Pb37 lead solder pastes are used in the assembly of printed circuit boards (PCBs) and SMT for a wide variety of applications, including hand-held electronic devices such as smart phones and tablets, computer motherboards, consumer electronic products, network servers, automotive systems, medical and military equipment and many others. 

Exported countries:

Brazil,India,UAE,America,Saudi-Arab,Pakistan,Iran,Egype,Turkey

Payment is flexible,T/T,western union,paypal,L/C at sight

Technical Datasheet

BBIEN TL-01 Sn63Pb37 solder paste size

Microprint's small particle size of 5-45µm(-450+600 mesh),guarantees repeatable print definition to below 0.3mm forµBga work


Application Characteristics

IPC ALLOY POWDER TYPE

Alloy powder size

Alloy powder content

Mixture flux

Standard Printing

3

25~45μm

89%

10~11%

Fine pitch printing

4

20~38μm

88.5%

10~11%

Fine pitch printing

5

15~25μm

89%

10~11%

Ultrafine pitch printing

6

10~18μm

90%

10%

Ultrafine pitch printing

7

5-12μm

85-90%

10~15%



Sort

Chemical composition(wt.%)

Sn

Pb

In

Ag

Cu

Au

Al

Zn

Fe

Bi

Ni

Cd

As

Sb

Sn63Pb37

62~

64

36~38

<0.001

<0.002

<0.05

<0.001

<0.001

<0.001

<0.1

<0.01

<0.01

<0.001

<0.003

<0.05

Sorts and metal compositions specification

REFLOW PROFLE DATA

Recommended reflow process parameters

Heating rate

the time required to 120ºC

constant temperature.

130-170ºC

peak tem.

>220°C

cooling rate

1-3ºC/sec

<60—90secs

60—120secs

<208-230ºC

<40—80secs

<4ºC/S

 

BBIEN TL-01 Sn63Pb37 Solder Paste Physical Speciality

Appearance:black/gray tacky paste

Sort

Melting Point

(℃)

Gravity(g/cm3)

Tensile Strength

(MPa)

Sn63-Pb37

183

8.9

50~60

Packing size

Item

Sorts

Jar packing Tube packing

Solder Paste

500g;50 100g

Advantage And Service

183 degree no clean lead solder paste BBIEN TL-01Sn63Pb37

.BBIEN is specialized in soldering industry from 2000,known as a experienced solder paste,syring tin lead solder paste,SMT solder paste manufacturer,whose products are made in China,since then,BBIEN pays high attention to Research and Development,continuous technical innovation for lead free solder paste industry,until now,we accumulate much valuable experience,six senior solder paste engineers operate a specialized reflowing solder paste production.

middle temperature no clean solder paste TL-01 BBIEN Sn63Pb37 offers excellent solderbility,wettibility and reliability amont leaded Pb contained solder paste,it is available in a wide product lineup according to the required soldering temperature.

Due to sophisticated technical in Sn-Pb alloy,BBIEN can supply the thinnest size of type7(5~12micron)for TL-01 BBIEN Sn63Pb37 no clean solder paste,normal size such as type6,type5,type4 and type3 are also available

TL-01 BBIEN Sn63Pb37 silver no clean solder paste can be not only applied to tradional electronics pcb,smt reflowing soldering,but also its application for some new hi-tech industry,semiconductor.LED,aerospace,automotive.

TL-01 BBIEN Sn63Pb37 middle temperature 183 degree Celsius low temperature solder paste can be packaged with jar 50,500g,which is used for stencil soldering;it can also be packed with 100g jet tube used for dispensing soldering.

Shipping Advantage

Mutiple-transportation oversea shipping ways by ari,by sea,by train and truck road way ensuring the shipment can arrive at destination all around the world safety,quickly and efficiently.

Shipment can be deliveried once placing order 2 to 10 working days.

Shipment will be regular go through local custom and its warehouse,BBIEN has own specialized shipping team and operators agent all over the world.

Technical Advantage

BBIEN can share the datasheet for our product to our clients.

Certificate of compliance,SGS,ISO and COA,MSDS,are available.

We are tyring to make our product quality system more and more complete,BBIEN also appreciate your precious suggestion.

Both pre-sale and after-sale,BBIEN have skilled person to follow-up our client,reply answer for reasonable price,relevant quality standard,products data informations,shipping for your questions skillfully,quickly,technical support is available.

Service

When you send us message,BBIEN will feedback you general within 2 working hours.Our customer service or sales person will be match with you above 10-24hours.And solve your problem on solder products.

OEM is available according to your own logo.

Return back to society

BBIEN also participates public benefit activities,return back to society.We support and want to create a environmental friendly society together with people.We also try our best to help someone who need us.

Payment way:

A variety and flexible of payment terms,T/T,western union,paypal,L/C can be acceptable.


BBIEN Technology is one of the professional manufacturers and suppliers of 183 degree no clean lead solder paste sn63pb37. We have professional workers who have consummate skills producing high quality products in our factory. Welcome to buy our discount and low price 183 degree no clean lead solder paste sn63pb37 made in China. Pricelist and quotation consultation are available if you need.

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