Mid Temperature Solder Paste Sn62Pb36Ag2

Middle temperature solder paste BBIEN TL-02 Sn62Pb36Ag2 BBIEN TL-02 leaded reflowing Pb solder paste Sn62Pb36Ag2 has been developed for the lead-containing SMD electronics manufacturing. This solder paste contains a highly active type ROL1 No-Clean flux. With a special composition for excellent wetting, it meets all requirements for good forming of solder joints. This No-Clean solder paste particularly displays its strengths on surfaces which are difficult to solder. The low amounts of residues after the reflow are light, transparent, electrically safe and do not have to be removed.

Details

Product Details

Middle and low temperature lead solder paste BBIEN TL-02 Sn62Pb36Ag2

Brief Introduction

BBIEN solder paste manufacturer has enough technique to make tin-lead-silver Sn62Pb36Ag2 solder paste,which is an organic acid,water-soluble solder paste that provides users with the highest level of consistency and performance.Batch after batch,Sn62Pb36Ag2 provides hours of stable stencil life,tack time and repeatable brick defini-tion.Sn62Pb36Ag2’s robust printing characteristics result in consistent solder paste volume regardless of idle time,stencil life and print speed.The activator package in the Sn62Pb36Ag2 is very aggressive and provides superior wetting to OSP-coated PCB’s and Ag/Pd components.

Sn62Pb36Ag2 Solder paste Melting information

Sn62Pb36Ag2 has a melting point about 179°C to 183 degree,and has been successfully used with peak reflow profiles between 155°C and 190°C.Contained 2%silver,which make soldering point is brighter and very good soldering result.The outstanding batch consistency,anti-slump chemistry,consistent print volumes,solderability and cleanability make the Sn62Pb36Ag2 an ideal water-soluble solder paste for any application.Stable wetting behavior over a wide range of profiles

Available type size of Sn62Pb36Ag2 solder paste

BBIEN supplies five types of solder paste for TL-02 Sn62Pb36Ag2 Pb no clean paste

Type7(5~12micron)lead solder paste for ultrafine pitch printing technique.

Type6(10~18micron)Sn-Pb-Ag solder paste/cream

Type5(15~25micron)no clean solder paste for leaded-SMD soldering

Type4(25~38micron)normal type of leaded solder paste for normal stencil and dispensing soldering.

Type3(25~45)tin lean solder paste

Available packing information

The Sn62Pb36Ag2 medium temperature lead solder paste could be classified as can/bottle packing and syringe packing type.

Each jar/can/bottle holds the solder paste/cream is 500g;

Each cartridge/syringe can load the solder paste/cream is 100g

The packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.

Carton size:34.5*27.5*23.5cm,10kg

Feature of BBIEN TL-02 Sn62Pb36Ag2 solder paste

The product offers the following advantages:

Exceptional print to print consistency

Suitable for fine pitch down to 0,4mm

Compatible with a wide range of solderable surfaces

Effective over a wide range of reflow profiles in air or nitrogen

Overall wide process window in print and reflow

High tackiness for high speed pick and place equipment

Temperature range for application 20-32°C

Application
BBIEN TL-02 Sn62Pb36Ag2 lead solder pastes was developed for stencil printing.In combination with the alloy Sn62Pb36Ag2 in solder particle size type 3(25-45µm)it can be used on every open stencil printing system.Typical application parameters:0.4-0.65mm Pitch at 150µm stencil thickness.

Typical application parameters:0.4-0.65mm Pitch at 150µm stencil thickness;

TL-02 Sn62Pb36Ag2 lead solder pastes are used in the assembly of printed circuit boards(PCBs)and SMT for a wide variety of applications,including hand-held electronic devices such as smart phones and tablets,computer motherboards,consumer electronic products,network servers,automotive systems,medical and military equipment and many others.

Recommendation for solder paste printing

1. Use always the thinnest possible stencil thickness.

2. Use always stencils with rounded corners,to reduce clogging of apertures to the lowest possible minimum.

3. Set the squeegee pressure to 1kg for each 5cm of squeegee length.Then reduce the pressure step by step,till the solder paste starts smearing on the stencil.Then add 1kg to the squeegee pressure and check,that the solder paste leaves no residues after printing on the surface of the stencil.Evaluate this parameter at your desired print speed.

4. Optimum print results can be achieved at print speeds between 10-75 mm sec-1.

5. Please ensure a perfect sealing between PCB and stencil.The PCB has to have the best possible support,to achieve the optimum sealing to the stencil,so that the solder paste cannot be printed between pads and stencil.This avoids solder balling.

6. Printer down times up to 30min can be achieved.The following first print after 1h should give good filling of apertures and a good print result.Open times of the PCB between print and reflow up to 24h can be realised by storing the printed PCB in a closed container to prevent the solvents from evaporating.

Storage,Handling,and Shelf Life:

Refrigeration is the recommended optimum storage condition for solderpaste to maintain consistent viscosity,

reflow characteristics and overall performance.HM531 should be stabilized at room temperature prior to printing.HM531 should be kept at standard refrigeration conditions,3-10°C Please contact BBIEN,if you require additional advice with regard storage and handling of this material.Shelf life is 6 months from date of manufacture when handled properly and held at 3-10°C.

Payment terms:

T/T,Western Union or Paypal,L/C could be discussed

Shipping way:

DHL,EMS,TNT,airway shipping,seaway acceptable

Exported counties

Russia,UAE,Saudi-Ara,Iran,Egype,Turkey,Columbia,Eastern European countries

Technical Datasheet

Middle and low temperature lead solder paste BBIEN TL-02 Sn62Pb36Ag2

Sn62Pb36Ag2 Solder Paste Reflow Profile

The reflow can be done either in air or nitrogen.Following is an example for a temperature profile for the solder paste TL-02 Sn62Pb36Ag2,which has shown good reflow results in practice with best wetting.Depending on the soldering equipment and PCBs,different temperature profiles may be used.This temperature profile can only be a recommendation.Our recommendation for this solder paste is to use a linear profile,as this will ensure the optimum activity of the solder paste and ensures perfect wetting.If a non-linear(soak)profile has to be used for some reasons,the temperature in the preheat area should not exceed 120sec.at max.160°C.

 

Physical Properties and Data

Solder powder:The solder powder for BBIEN TL-02 Sn62Pb36Ag2 solder pastes is produced by atomising alloys conforming to the purity requirements of J-STD-006,EN 29453 or other national and international standards where relevant.Careful control of production processes ensures exact solder powder particle distribution in a spherical shape.

GENERAL PROPERTIES

BBIEN TL-02

Alloy:

Sn62/Pb36/Ag2

Melting Point Range(°C)

179

Metal content

90%Solder powder

10%Mixture flux

Solder powder

Type3(25-45µm);Type4(25-38µm);Type5(15-25µm);Type6(10-18µm);Type7(5-12µm);

Application

Stencil printing

Dispensing printing

Viscosity Brookfield cPs(1),25°C

650.000-850.000

TESTS SPECIFICATION RESULT

SPECIFICATION

RESULT

Copper mirror corrosion:

IPC-SF-818/ANSI J-STD-004

Pass,type L

Surface insulation resistance (without cleaning):

IPC-SF818

Pass

ANSI J-STD-004-IPC-TM650

Pass

Electro migration:

IPC-SF-818/ANSI J-STD-004

Pass

Solder balling:

After 1h@RT

Pass,class1

After 24@RT

Pass,class1

Tackiness:

JIS-Z-3284

At least 100g after 24h

Flux Activity Classification(without cleaning):

DIN 29454-1

1.1.2.C

ANSI J-STD-004(IPC-SF-818)

L1

Metal composition


Specification

Sn62Pb36Ag2 solder paste

Appearance

Black tacky past appearance

Weigh

500g/jar,100g/syringe;10kg/ctn



Sort

Chemical composition(wt.%)

Sn

Pb

Ag

Cu

Bi

Zn

Sb

Fe

Al

As

Cd

Sn62-Pb36-Ag2

62±0.5

36±0.5

20±0.2

0.08

<0.1

0.03

<0.03

<0.02

<0.005

<0.003

<0.002

Advantage And Service

179 degree no clean lead solder paste BBIEN TL-02Sn62Pb36Ag2

Product Advantage

1) Microprint's small particle size of 5-45µm (-450+600 mesh), guarantees repeatable print definition to below 0.3mm for µBga work

2) TL-02 Sn62Pb36Ag2 solder paste have following types

Application Characteristics

IPC ALLOY POWDER TYPE

Alloy powder size

Alloy powder content

Mixture flux

Standard Printing

3

 25~45 μm

89 %

10~11%

Fine pitch printing

4

20~38 μm

 88.5 %

10~11%

Fine pitch printing

5

 15~25 μm

89 %

10~11%

Ultrafine pitch printing

6

10~18μm

90%

10%

Ultrafine pitch printing

7

5-12μm

85-90%

10~15%

BBIEN is specialized in soldering industry from 2000, known as a experienced solder paste,syring tin lead solder paste,SMT solder paste manufacturer,whose products are made in China,since then,BBIEN pays high attention to Research and Development,continuous technical innovation for lead free solder paste industry,until now,we accumulate much valuable experience,six senior solder paste engineers operate a specialized reflowing solder paste production.

middle temperature no clean solder paste TL-02 BBIEN Sn62Pb36Ag2 offers excellent solderbility,wettibility and reliability amont leaded Pb contained solder paste, it is available in a wide product lineup according to the required soldering temperature.

Due to sophisticated technical in Sn-Pb alloy,BBIEN can supply the thinnest size of type7(5~12micron) for TL-02 BBIEN Sn62Pb36Ag2 no clean solder paste, normal size such as type6,type5,type4 and type3 are also available

TL-02 BBIEN Sn62Pb36Ag2 silver no clean solder paste can be not only applied to tradional electronics pcb,smt reflowing soldering,but also its application for some new hi-tech industry, semiconductor.LED,aerospace,automotive.

TL-02 BBIEN Sn62Pb36Ag2 middle temperature 179 degree Celsius low temperature solder paste can be packaged with jar 50,500g,which is used for stencil soldering;it can also be packed with 100g jet tube used for  dispensing soldering.

Shipping Advantage

Mutiple-transportation oversea shipping ways by ari,by sea,by train and truck road way ensuring the shipment can arrive at destination all around the world safety ,quickly and efficiently.

Shipment can be deliveried once placing order 2 to 10 working days.

Shipment will be regular go through local custom and its warehouse,BBIEN has own specialized shipping team and operators agent all over the world.

Technical Advantage

BBIEN can share the datasheet for our product to our clients.

Certificate of compliance,SGS,ISO and COA,MSDS,are available.

We are tyring to make our product quality system more and more complete, BBIEN also appreciate your precious suggestion. 

Both pre-sale and after-sale,BBIEN have skilled person to follow-up our client,reply answer for reasonable price,relevant quality standard,products data informations,shipping for your questions skillfully,quickly,technical support is available.

Service

When you send us message,BBIEN will feedback you general within 2 working hours.Our customer service or sales person will be match with you above 10-24hours. And solve your problem on solder products.

OEM is available according to your own logo.

Return back to society

BBIEN also participates public benefit activities,return back to society.We support and want to create a environmental friendly society together with people.We also try our best to help someone who need us.

Payment way:

A variety and flexible of payment terms,T/T,western union,paypal,L/C can be acceptable.

BBIEN Technology is one of the professional manufacturers and suppliers of mid temperature solder paste sn62pb36ag2. We have professional workers who have consummate skills producing high quality products in our factory. Welcome to buy our discount and low price mid temperature solder paste sn62pb36ag2 made in China. Pricelist and quotation consultation are available if you need.

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