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2 0mm no clean type Sn40Pb60

  • 0.1mm No-clean Flux Core Wire Solder Sn96.5Ag3.0Cu0.5

    Contact Now0.1mm No-clean Flux Core Wire Solder Sn96.5Ag3.0Cu0.5No-clean flux core wire solder 0.1mm to 3.0mm BBIEN LF-01 Sn96.5Ag3.0Cu0.5 BBIEN LF-01 Sn96.5Ag3.0Cu0.5 no clean flux core solder wire are both a halide-free and halogen type available,not water-soluble,flux cored and solid solder wire,melting point is 217 degree Celsius high temperature.BBIEN LF-01 Sn96.5Ag3.0Cu0.5 Pb free tin-silver solder wire is also belongs to RoHS standard wire solder,the diameter of this solder can be above 0.1mm(0.1mm~0.15mm),0.2mm,0.3mm…1,0mm…Read More

  • High Quality Leaded No Clean Solder Wire Sn60Pb40

    Contact NowHigh Quality Leaded No Clean Solder Wire Sn60Pb40High quality Leaded no clean solder wire Sn60Pb40 Sn60Pb40 rosin flux core wire solder is an activated rosin formula for use in flux-cored solder wire. It has virtually dominated the field of activated rosin core solders for well over four decades. An outstanding performance to repair kinds of electronics,celphone. Feature of this flux core solder wire is the “instant-action” wetting behavior. The high mobility and fast-spreading action of this flux results in more reliable production line soldering.Read More

  • Pb Lead Solder Wire Sn45Pb55 Sn40Pb60 Sn30 Pb70 Sn20Pb80 No Clean Type

    Contact NowPb Lead Solder Wire Sn45Pb55 Sn40Pb60 Sn30 Pb70 Sn20Pb80 No Clean TypePb lead solder wire Sn45Pb55 Sn40Pb60 Sn30/Pb70 Sn20Pb80 no clean type BBIEN also has high content of lead(Pb),Sn-Pb series solder wires Sn45Pb55,Sn40Pb60 Sn30Pb70,Sn20Pb80 flux core wire and solid solder wires.They are very low tin dross soldering wire and designed for no-clean hand soldering applications.The flux core provides sufficient activity to solder successfully to bare copper and other demanding applications. Diameter can be avalible for 1.2mm,1.0mm,0.8mm,0.5mm,2.0mm solder wiresRead More

  • 183 Degree No Clean Lead Solder Paste Sn63Pb37

    Contact Now183 Degree No Clean Lead Solder Paste Sn63Pb37183 degree no clean lead solder paste BBIEN TL-01 Sn63Pb37 BBIEN TL-01 Sn63Pb37 no clean tin lead solder paste its melting point is 183 degree Celsius was developed to meet the demands of tin lead soldering when lead free components are present in the circuit assembly.Like all BBIEN solder pastes,SN63PB37 leaded solder paste has excellent print volume repeatability to minimize variation in the print process.SN63PB37 minimizes print cyle times through high print speeds and extended number of prints between stencils under cleaning.Naormal type 3 no clean solder paste is made for Sn63/Pb37,type4,type5,type6 and type7 lead contain solder paste are also available.Read More

  • No Clean Lead Free Silver Solder Wire Sn99Ag0.3Cu0.7

    Contact NowNo Clean Lead Free Silver Solder Wire Sn99Ag0.3Cu0.7No clean lead free silver solder wire BBIEN LF-02 Sn99Ag0.3Cu0.7 BBIEN LF-02 Sn99Ag0.3Cu0.7 flux core, no clean high temperature 227degree Celsius solder wire is a low residue flux core solder designed for hand soldering and to repair electronics applications. Sn99Ag0.3Cu0.7 flux core solder wire is a newly developed cored wire that is specifically designed to meet JIS Class AA requirements, with a halide content <1,000ppm, for no-clean lead-free applications.  It offers the balance of high SIR reliability and excellent spread characteristics.  It is among the best performing products in the our cored Wire product portfolio.  The pay off is not only an excellent soldering performance, but also a reliable material that is able to comply to IPC flux ROL1 classification.Read More

  • Type7 High Ag No Clean Solder Paste SAC305

    Contact NowType7 High Ag No Clean Solder Paste SAC305High Ag no clean solder paste SAC305 Solder paste is a form of solder that is used in PCB,SMD,SMT assembly, and including prototype PCB assembly, especially when using reflow soldering techniques. BBIEN’s LF-01 lead free solder paste SAC305 is a type of high silver content lead free no-clean solder paste specifically formulated to accommodate the higher processing temperatures required alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. LF-01 lead free solder paste SAC305(Sn96.5Ag3.0Cu0.5) offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.Read More

  • Sn Pb Lead Alloy Bar Solder Sn70Pb30 Sn40Pb60 Sn30Pb70

    Contact NowSn Pb Lead Alloy Bar Solder Sn70Pb30 Sn40Pb60 Sn30Pb70Sn/Pb lead alloy bar solder Sn70Pb30 Sn40Pb60 Sn30Pb70 BBIEN tin-lead solder bar(tin solder bar)is applicable to various high temperature soldering,especially good in inductance wires,transformer and other industries.The tin alloy solder bar alloy composition can be changed according to specific requirement.Their appearance is bright stcik/bar Sn70Pb30 Sn40Pb60 Sn30Pb70 Soldering tin bar is applicable to 1.high temperature soldering 2.good in inductance wires,transformer and other industriesRead More

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