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Reflowing solder paste

  • 183 Degree No Clean Lead Solder Paste Sn63Pb37

    Contact Now183 Degree No Clean Lead Solder Paste Sn63Pb37183 degree no clean lead solder paste BBIEN TL-01 Sn63Pb37 BBIEN TL-01 Sn63Pb37 no clean tin lead solder paste its melting point is 183 degree Celsius was developed to meet the demands of tin lead soldering when lead free components are present in the circuit assembly.Like all BBIEN solder pastes,SN63PB37 leaded solder paste has excellent print volume repeatability to minimize variation in the print process.SN63PB37 minimizes print cyle times through high print speeds and extended number of prints between stencils under cleaning.Naormal type 3 no clean solder paste is made for Sn63/Pb37,type4,type5,type6 and type7 lead contain solder paste are also available.Read More

  • High Temperature Solder Paste SACX0307

    Contact NowHigh Temperature Solder Paste SACX0307High temperature solder paste SACX0307 SACX0307(Sn99Ag0.3Cu0.7) is made with solder blenders, It is lead free, organic acid, rosin flux solder paste that provides users with the highest level of consistency performance. Its melting point is 227degree Celsius, high copper and low silver composition,it is high temperature solder paste, working temperature from120degree Celsius to 280 degree Celsius.Batch after batch, SAC0307 provides hours of stable stencil life, tack time and repeatable brick definition. SAC0307 robust printing characteristics result in consistent solder paste volume regardless of idle time, stencil life and print speed. The activator package in the SAC0307 is very aggressive and provides superior wetting to OSP coated and Immersion Silver boards. Generally used is type3 and type 4 powder.Read More

  • Mid Temperature Solder Paste Sn62Pb36Ag2

    Contact NowMid Temperature Solder Paste Sn62Pb36Ag2Middle temperature solder paste BBIEN TL-02 Sn62Pb36Ag2 BBIEN TL-02 leaded reflowing Pb solder paste Sn62Pb36Ag2 has been developed for the lead-containing SMD electronics manufacturing. This solder paste contains a highly active type ROL1 No-Clean flux. With a special composition for excellent wetting, it meets all requirements for good forming of solder joints. This No-Clean solder paste particularly displays its strengths on surfaces which are difficult to solder. The low amounts of residues after the reflow are light, transparent, electrically safe and do not have to be removed.Read More

  • Type7 High Ag No Clean Solder Paste SAC305

    Contact NowType7 High Ag No Clean Solder Paste SAC305High Ag no clean solder paste SAC305 Solder paste is a form of solder that is used in PCB,SMD,SMT assembly, and including prototype PCB assembly, especially when using reflow soldering techniques. BBIEN’s LF-01 lead free solder paste SAC305 is a type of high silver content lead free no-clean solder paste specifically formulated to accommodate the higher processing temperatures required alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. LF-01 lead free solder paste SAC305(Sn96.5Ag3.0Cu0.5) offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.Read More

  • Mid Temperature Solder Paste Sn64.7Bi35Ag0.3

    Contact NowMid Temperature Solder Paste Sn64.7Bi35Ag0.3Mid temperature solder paste LF-04 Sn64.7Bi35Ag0.3 To meet the demand of high-density and memory/logic options for sophisticated electronic devices, many assemblers are evaluating package on package (PoP) technology. PoP assemblies allow for higher electronic functionality per unit circuit board area, and allows low cost product memory customization, and highly flexible manufacturing. Unlike PoP flux, BBIEN LF-04 Sn64.7Bi35Ag0.3 solder paste uses flux and solder powder, to minimize defects associated with non-planar processor/memory combinations during the reflow process.Read More

  • 179 Degree Tin Bismuth Silver Solder Paste Sn64Bi35Ag1

    Contact Now179 Degree Tin Bismuth Silver Solder Paste Sn64Bi35Ag1BBIEN’S LF-03 Sn64Bi35Ag1 bismuth Pb free reflowing solder paste is middle temperature type,its melting point is 179 degree Celsius,generally, Sn64Bi35Ag melting point is not stable, its range from 138degree Celsius to 179degree Celsius. Sn64Bi35Ag is a between traditional and new generation paste family improving upon the industry standard with excellent printing stability, enhanced heat resistance, reduced flux splattering, head-in-pillow elimination and tack power. BBIEN can supply type3,type4,type5,type6 and type7 jet solder paste 100g per syringe for dispensing technique and stencil 50g,500g jar. Exported countries: Saudi-Arab, Egpe,Germany, South Korea, Russia, America, UAE,Brazial,India,IranRead More

  • 138 Degree Melting Low Temperature Solder Paste Sn42Bi58

    Contact Now138 Degree Melting Low Temperature Solder Paste Sn42Bi58138degree melting low temperature solder paste LF-05 Sn42Bi58 BBIEN LF-05 Sn42-Bi58 melting point is 138 degree Celsius, it is a lead-free, organic acid, not water-soluble solder paste formula specifically designed for use with the low temperature Pb-Free, alternative halogen and halogen free tin-bismuth soldering paste alloy . The solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability to a wide variety of metallic substrates. Packing of 500g,50 per jar and 100g per cartridge, normal type3 and type4 solder paste, while special type5,type6 and type7 solder paste are all available.Read More

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