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Reflowing solder paste

  • Type7 High Ag No Clean Solder Paste SAC305

    Contact NowType7 High Ag No Clean Solder Paste SAC305High Ag no clean solder paste SAC305 Solder paste is a form of solder that is used in PCB,SMD,SMT assembly, and including prototype PCB assembly, especially when using reflow soldering techniques. BBIEN’s LF-01 lead free solder paste SAC305 is a type of high silver content lead free no-clean solder paste specifically formulated to accommodate the higher processing temperatures required alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. LF-01 lead free solder paste SAC305(Sn96.5Ag3.0Cu0.5) offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.Read More

  • 179 Degree Tin Bismuth Silver Solder Paste Sn64Bi35Ag1

    Contact Now179 Degree Tin Bismuth Silver Solder Paste Sn64Bi35Ag1BBIEN’S LF-03 Sn64Bi35Ag1 bismuth Pb free reflowing solder paste is middle temperature type,its melting point is 179 degree Celsius,generally, Sn64Bi35Ag melting point is not stable, its range from 138degree Celsius to 179degree Celsius. Sn64Bi35Ag is a between traditional and new generation paste family improving upon the industry standard with excellent printing stability, enhanced heat resistance, reduced flux splattering, head-in-pillow elimination and tack power. BBIEN can supply type3,type4,type5,type6 and type7 jet solder paste 100g per syringe for dispensing technique and stencil 50g,500g jar. Exported countries: Saudi-Arab, Egpe,Germany, South Korea, Russia, America, UAE,Brazial,India,IranRead More

  • Mid Temperature Solder Paste Sn62Pb36Ag2

    Contact NowMid Temperature Solder Paste Sn62Pb36Ag2Middle temperature solder paste BBIEN TL-02 Sn62Pb36Ag2 BBIEN TL-02 leaded reflowing Pb solder paste Sn62Pb36Ag2 has been developed for the lead-containing SMD electronics manufacturing. This solder paste contains a highly active type ROL1 No-Clean flux. With a special composition for excellent wetting, it meets all requirements for good forming of solder joints. This No-Clean solder paste particularly displays its strengths on surfaces which are difficult to solder. The low amounts of residues after the reflow are light, transparent, electrically safe and do not have to be removed.Read More

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