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Sn96 5Ag3 0Cu0 5 silver solder wire

  • 227degree Tin-copper Solder Wire Sn99.3Cu0.7

    Contact Now227degree Tin-copper Solder Wire Sn99.3Cu0.7227degree tin-copper solder wire BBIEN LF-03 Sn99.3Cu0.7 BBIEN LF-03 Sn99.3Cu0.7 lead free soldering wire is based on a"No-Clean"flux and is available with lead-free alloy,its melting point is 227degree Celsius,can be used for repairing almost electronics,chips,pcb,lead free items.It has been developed for usual requirements for conventional soldering and for soldering in industrial production and for repair and resoldering.The smallest diameter size can be above 0.15mm(0.2mm,0.3mm,0.5mm,0.6mm,0.8mm,1.0mm,1.2mm,1.5mm,2.0mm…),packing with 100g,200g,250g,500g,1kg per spool.Read More

  • Mid Temperature Solder Paste Sn62Pb36Ag2

    Contact NowMid Temperature Solder Paste Sn62Pb36Ag2Middle temperature solder paste BBIEN TL-02 Sn62Pb36Ag2 BBIEN TL-02 leaded reflowing Pb solder paste Sn62Pb36Ag2 has been developed for the lead-containing SMD electronics manufacturing. This solder paste contains a highly active type ROL1 No-Clean flux. With a special composition for excellent wetting, it meets all requirements for good forming of solder joints. This No-Clean solder paste particularly displays its strengths on surfaces which are difficult to solder. The low amounts of residues after the reflow are light, transparent, electrically safe and do not have to be removed.Read More

  • Mid Temperature Solder Paste Sn64.7Bi35Ag0.3

    Contact NowMid Temperature Solder Paste Sn64.7Bi35Ag0.3Mid temperature solder paste LF-04 Sn64.7Bi35Ag0.3 To meet the demand of high-density and memory/logic options for sophisticated electronic devices, many assemblers are evaluating package on package (PoP) technology. PoP assemblies allow for higher electronic functionality per unit circuit board area, and allows low cost product memory customization, and highly flexible manufacturing. Unlike PoP flux, BBIEN LF-04 Sn64.7Bi35Ag0.3 solder paste uses flux and solder powder, to minimize defects associated with non-planar processor/memory combinations during the reflow process.Read More

  • 179 Degree Tin Bismuth Silver Solder Paste Sn64Bi35Ag1

    Contact Now179 Degree Tin Bismuth Silver Solder Paste Sn64Bi35Ag1BBIEN’S LF-03 Sn64Bi35Ag1 bismuth Pb free reflowing solder paste is middle temperature type,its melting point is 179 degree Celsius,generally, Sn64Bi35Ag melting point is not stable, its range from 138degree Celsius to 179degree Celsius. Sn64Bi35Ag is a between traditional and new generation paste family improving upon the industry standard with excellent printing stability, enhanced heat resistance, reduced flux splattering, head-in-pillow elimination and tack power. BBIEN can supply type3,type4,type5,type6 and type7 jet solder paste 100g per syringe for dispensing technique and stencil 50g,500g jar. Exported countries: Saudi-Arab, Egpe,Germany, South Korea, Russia, America, UAE,Brazial,India,IranRead More

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