Home > Products > lead silver powder

lead silver powder

  • Tin Silver Solder Wire SnAg 0.3~1.0

    Contact NowTin Silver Solder Wire SnAg 0.3~1.0Tin silver solder wire BBIEN LF-07 Sn-Ag(0.3~1.0) Description for Sn-Ag solder wire BBIEN LF-07 Sn-Ag(0.3-1.0)tin silver solder wire is a high melting point solder wires,the content of silver(Ag)0.3%,0.35~0.38%,0.4%,0.5%...1.0%is,and tin(Sn)99%~99.7%.Sn-Ag series solder wire is a newly developed...Read More

  • Pb Lead Solder Wire Sn45Pb55 Sn40Pb60 Sn30 Pb70 Sn20Pb80 No Clean Type

    Contact NowPb Lead Solder Wire Sn45Pb55 Sn40Pb60 Sn30 Pb70 Sn20Pb80 No Clean TypePb lead solder wire Sn45Pb55 Sn40Pb60 Sn30/Pb70 Sn20Pb80 no clean type BBIEN also has high content of lead(Pb),Sn-Pb series solder wires Sn45Pb55,Sn40Pb60 Sn30Pb70,Sn20Pb80 flux core wire and solid solder wires.They are very low tin dross soldering wire and designed for no-clean hand soldering applications.The flux core provides sufficient activity to solder successfully to bare copper and other demanding applications. Diameter can be avalible for 1.2mm,1.0mm,0.8mm,0.5mm,2.0mm solder wiresRead More

  • Rosin Core Tin-lead Solder Wire Sn63Pb37

    Contact NowRosin Core Tin-lead Solder Wire Sn63Pb37Rosin core tin-lead solder wire Sn63Pb37 Sn63Pb37 RMA core wire solder is a type of wire no-clean flux core solder wire,is the best quality of leaded solder wire,a low residue flux core solder designed for tin-lead hand soldering and re-work applications.The flux core provides sufficient activity to successfully solder bare copper,tin,silver,gold and other hard-to-solder surfaces.Packing of 100g,200g,250g,500g and 1kg per spool;tube packing 15g/tube can be customized.Diameter above 0.3mm(0.5mm,0.6mm,0.8mm,1.0mm,1.2mm…)Read More

  • Tin Lead silver solder wire Sn62Pb36Ag2

    Contact NowTin Lead silver solder wire Sn62Pb36Ag2Tin Lead silver halogens free solder wireSn62Pb36Ag2 During the processing of BBIEN no-clean solder wire strict quality control management and the advanced drawing process are implemented.Meanwhile,the ratio of both trace metals and impurity substances in the wires are precisely controlled and the welding flux in the wires is distributed uniformly to insure welding continuity.Besides a clean and tidy packing as well as a bright and smooth surface,BBIEN Technology's Sn62Pb36Ag2 soft soldering wire,in welding process,also provide excellent wettability and weldability,keeping the process in a friendly environment of few smell,few smoke,few flitting,and non-toxic environment. Diameter 0.5mm,0.6mm0.8mm1.0mm.2.0mm Tolerance0. Net Weight0.5kg、1.0kg All kinds of wires(e.g.tin-lead,flux core,solid core) MOQ:30kgRead More

  • Sn-Bi-Ag Lead Free Soft Solid Solder Wire Sn64Bi35Ag1

    Contact NowSn-Bi-Ag Lead Free Soft Solid Solder Wire Sn64Bi35Ag1Sn-Bi-Ag 179degree lead free soft solid solder wire With the development requirement of world environmental protection,lead free solder wire will gradually replace the tin-lead solder wires.SHEN ZHEN BBIEN TECHNOLOGY CO.,LTD apply for the advanced technology,do research and development more and more special and very usefully lead free solder wire,low and middle temperature solder wire,Tin Bismuth Silver solder wireSn64Bi35Ag1,melting point is 179degree,diameter available e.g.0.5mm,0.6mm,0.8mm,1.0mm,1.5mm,2.0mm.Read More

  • 179degree tin bismuth silver solder paste Sn64Bi35Ag1

    Contact Now179degree tin bismuth silver solder paste Sn64Bi35Ag1BBIEN’S LFSP-03 Sn64Bi35Ag1 bismuth Pb free reflowing solder paste is middle temperature type,its melting point is 179 degree Celsius,generally, Sn64Bi35Ag melting point is not stable, its range from 138degree Celsius to 179degree Celsius. Sn64Bi35Ag is a between traditional and new generation paste family improving upon the industry standard with excellent printing stability, enhanced heat resistance, reduced flux splattering, head-in-pillow elimination and tack power. BBIEN can supply type3,type4,type5,type6 and type7 jet solder paste 100g per syringe for dispensing technique and stencil 50g,500g jar. Exported countries: Saudi-Arab, Egpe,Germany, South Korea, Russia, America, UAE,Brazial,India,IranRead More

  • No Clean Lead free Silver Solder Wire Sn99Ag0.3Cu0.7

    Contact NowNo Clean Lead free Silver Solder Wire Sn99Ag0.3Cu0.7No clean lead free silver solder wire BBIEN LF-02 Sn99Ag0.3Cu0.7 BBIEN LF-02 Sn99Ag0.3Cu0.7 flux core, no clean high temperature 227degree Celsius solder wire is a low residue flux core solder designed for hand soldering and to repair electronics applications. Sn99Ag0.3Cu0.7 flux core solder wire is a newly developed cored wire that is specifically designed to meet JIS Class AA requirements, with a halide content <1,000ppm, for no-clean lead-free applications.  It offers the balance of high SIR reliability and excellent spread characteristics.  It is among the best performing products in the our cored Wire product portfolio.  The pay off is not only an excellent soldering performance, but also a reliable material that is able to comply to IPC flux ROL1 classification.Read More

  • No Clean Tin Lead Solder Paste Sn63Pb37

    Contact NowNo Clean Tin Lead Solder Paste Sn63Pb37No clean tin lead solder paste Sn63Pb37 BBIEN TLSP-01 No clean tin lead solder paste Sn63Pb37 its melting point is 183 degree Celsius was developed to meet the demands of tin lead soldering when lead free components are present in the circuit assembly.Like all BBIEN solder pastes,SN63PB37 leaded solder paste has excellent print volume repeatability to minimize variation in the print process.SN63PB37 minimizes print cyle times through high print speeds and extended number of prints between stencils under cleaning.Naormal type 3 no clean solder paste is made for Sn63/Pb37,type4,type5,type6 and type7 lead contain solder paste are also available.Read More

  • Not Water-Soluble Tin Lead Solder Wire Sn50Pb50

    Contact NowNot Water-Soluble Tin Lead Solder Wire Sn50Pb50Not water-Soluble tin lead solder wire Sn50Pb50 BBIEN TL-05 Sn50Pb50 RA flux core wire,is a not water-soluble core wire,but no clen type.It is a very low halide(<1000ppm)cored wire solder, the flux core type can be divided into 1.5%,2.0%.3.0% Its post-soldering residue is very low,can be easily cleaned with DI water. BBIEN TL-05 Sn50Pb50 core wire is recommended for use in any hand soldering application where high flux activity is desired. Working temperature 170~210degree.Read More

  • 0.1mm Lead Free Solder Wire Sn96.5Ag3.0Cu0.5

    Contact Now0.1mm Lead Free Solder Wire Sn96.5Ag3.0Cu0.5No-clean flux core wire solder 0.1mm to 3.0mm BBIEN LF-01 Sn96.5Ag3.0Cu0.5 BBIEN LF-01 0.1mm lead free solder wire Sn96.5Ag3.0Cu0.5 are both a halide-free and halogen type available,not water-soluble,flux cored and solid solder wire,melting point is 217 degree Celsius high temperature.BBIEN LF-01 Sn96.5Ag3.0Cu0.5 Pb free tin-silver solder wire is also belongs to RoHS standard wire solder,the diameter of this solder can be above 0.1mm(0.1mm~0.15mm),0.2mm,0.3mm…1,0mm…Read More

Subscribe to our email list
Sign up with your name and email to get the latest proway updates, exclusive access to promotions,        sales events, pre-order sales & more!
Connect with BBIEN
Become our fan, follow us & subscribe for the latest updates        and deals
QR Code
  • About Us
  • Products
  • News
  • Exhibition
  • Contact Us
  • Feedback
  • Download & Knowledge
  • Copyright © Shenzhen BBIEN Technology Co.,Ltd All rights reserved.