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reflowing solder paste

  • No Clean Lead Free Silver Solder Wire Sn99Ag0.3Cu0.7

    Contact NowNo Clean Lead Free Silver Solder Wire Sn99Ag0.3Cu0.7No clean lead free silver solder wire BBIEN LF-02 Sn99Ag0.3Cu0.7 BBIEN LF-02 Sn99Ag0.3Cu0.7 flux core, no clean high temperature 227degree Celsius solder wire is a low residue flux core solder designed for hand soldering and to repair electronics applications. Sn99Ag0.3Cu0.7 flux core solder wire is a newly developed cored wire that is specifically designed to meet JIS Class AA requirements, with a halide content <1,000ppm, for no-clean lead-free applications.  It offers the balance of high SIR reliability and excellent spread characteristics.  It is among the best performing products in the our cored Wire product portfolio.  The pay off is not only an excellent soldering performance, but also a reliable material that is able to comply to IPC flux ROL1 classification.Read More

  • 227degree Tin-copper Solder Wire Sn99.3Cu0.7

    Contact Now227degree Tin-copper Solder Wire Sn99.3Cu0.7227degree tin-copper solder wire BBIEN LF-03 Sn99.3Cu0.7 BBIEN LF-03 Sn99.3Cu0.7 lead free soldering wire is based on a"No-Clean"flux and is available with lead-free alloy,its melting point is 227degree Celsius,can be used for repairing almost electronics,chips,pcb,lead free items.It has been developed for usual requirements for conventional soldering and for soldering in industrial production and for repair and resoldering.The smallest diameter size can be above 0.15mm(0.2mm,0.3mm,0.5mm,0.6mm,0.8mm,1.0mm,1.2mm,1.5mm,2.0mm…),packing with 100g,200g,250g,500g,1kg per spool.Read More

  • Mid Temperature Solder Paste Sn64.7Bi35Ag0.3

    Contact NowMid Temperature Solder Paste Sn64.7Bi35Ag0.3Mid temperature solder paste LF-04 Sn64.7Bi35Ag0.3 To meet the demand of high-density and memory/logic options for sophisticated electronic devices, many assemblers are evaluating package on package (PoP) technology. PoP assemblies allow for higher electronic functionality per unit circuit board area, and allows low cost product memory customization, and highly flexible manufacturing. Unlike PoP flux, BBIEN LF-04 Sn64.7Bi35Ag0.3 solder paste uses flux and solder powder, to minimize defects associated with non-planar processor/memory combinations during the reflow process.Read More

  • 138 Degree Melting Low Temperature Solder Paste Sn42Bi58

    Contact Now138 Degree Melting Low Temperature Solder Paste Sn42Bi58138degree melting low temperature solder paste LF-05 Sn42Bi58 BBIEN LF-05 Sn42-Bi58 melting point is 138 degree Celsius, it is a lead-free, organic acid, not water-soluble solder paste formula specifically designed for use with the low temperature Pb-Free, alternative halogen and halogen free tin-bismuth soldering paste alloy . The solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability to a wide variety of metallic substrates. Packing of 500g,50 per jar and 100g per cartridge, normal type3 and type4 solder paste, while special type5,type6 and type7 solder paste are all available.Read More

  • 179 Degree Tin Bismuth Silver Solder Paste Sn64Bi35Ag1

    Contact Now179 Degree Tin Bismuth Silver Solder Paste Sn64Bi35Ag1BBIEN’S LF-03 Sn64Bi35Ag1 bismuth Pb free reflowing solder paste is middle temperature type,its melting point is 179 degree Celsius,generally, Sn64Bi35Ag melting point is not stable, its range from 138degree Celsius to 179degree Celsius. Sn64Bi35Ag is a between traditional and new generation paste family improving upon the industry standard with excellent printing stability, enhanced heat resistance, reduced flux splattering, head-in-pillow elimination and tack power. BBIEN can supply type3,type4,type5,type6 and type7 jet solder paste 100g per syringe for dispensing technique and stencil 50g,500g jar. Exported countries: Saudi-Arab, Egpe,Germany, South Korea, Russia, America, UAE,Brazial,India,IranRead More

  • 183 Degree No Clean Lead Solder Paste Sn63Pb37

    Contact Now183 Degree No Clean Lead Solder Paste Sn63Pb37183 degree no clean lead solder paste BBIEN TL-01 Sn63Pb37 BBIEN TL-01 Sn63Pb37 no clean tin lead solder paste its melting point is 183 degree Celsius was developed to meet the demands of tin lead soldering when lead free components are present in the circuit assembly.Like all BBIEN solder pastes,SN63PB37 leaded solder paste has excellent print volume repeatability to minimize variation in the print process.SN63PB37 minimizes print cyle times through high print speeds and extended number of prints between stencils under cleaning.Naormal type 3 no clean solder paste is made for Sn63/Pb37,type4,type5,type6 and type7 lead contain solder paste are also available.Read More

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