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tin bismuth solder paste

  • High Temperature Solder Paste SACX0307

    Contact NowHigh Temperature Solder Paste SACX0307High temperature solder paste SACX0307 SACX0307(Sn99Ag0.3Cu0.7) is made with solder blenders, It is lead free, organic acid, rosin flux solder paste that provides users with the highest level of consistency performance. Its melting point is 227degree Celsius, high copper and low silver composition,it is high temperature solder paste, working temperature from120degree Celsius to 280 degree Celsius.Batch after batch, SAC0307 provides hours of stable stencil life, tack time and repeatable brick definition. SAC0307 robust printing characteristics result in consistent solder paste volume regardless of idle time, stencil life and print speed. The activator package in the SAC0307 is very aggressive and provides superior wetting to OSP coated and Immersion Silver boards. Generally used is type3 and type 4 powder.Read More

  • 179 Degree Tin Bismuth Silver Solder Paste Sn64Bi35Ag1

    Contact Now179 Degree Tin Bismuth Silver Solder Paste Sn64Bi35Ag1BBIEN’S LF-03 Sn64Bi35Ag1 bismuth Pb free reflowing solder paste is middle temperature type,its melting point is 179 degree Celsius,generally, Sn64Bi35Ag melting point is not stable, its range from 138degree Celsius to 179degree Celsius. Sn64Bi35Ag is a between traditional and new generation paste family improving upon the industry standard with excellent printing stability, enhanced heat resistance, reduced flux splattering, head-in-pillow elimination and tack power. BBIEN can supply type3,type4,type5,type6 and type7 jet solder paste 100g per syringe for dispensing technique and stencil 50g,500g jar. Exported countries: Saudi-Arab, Egpe,Germany, South Korea, Russia, America, UAE,Brazial,India,IranRead More

  • Mid Temperature Solder Paste Sn62Pb36Ag2

    Contact NowMid Temperature Solder Paste Sn62Pb36Ag2Middle temperature solder paste BBIEN TL-02 Sn62Pb36Ag2 BBIEN TL-02 leaded reflowing Pb solder paste Sn62Pb36Ag2 has been developed for the lead-containing SMD electronics manufacturing. This solder paste contains a highly active type ROL1 No-Clean flux. With a special composition for excellent wetting, it meets all requirements for good forming of solder joints. This No-Clean solder paste particularly displays its strengths on surfaces which are difficult to solder. The low amounts of residues after the reflow are light, transparent, electrically safe and do not have to be removed.Read More

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