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type 7 solder powder

  • High Temperature Solder Paste SACX0307

    Contact NowHigh Temperature Solder Paste SACX0307High temperature solder paste SACX0307 SACX0307(Sn99Ag0.3Cu0.7) is made with solder blenders, It is lead free, organic acid, rosin flux solder paste that provides users with the highest level of consistency performance. Its melting point is 227degree Celsius, high copper and low silver composition,it is high temperature solder paste, working temperature from120degree Celsius to 280 degree Celsius.Batch after batch, SAC0307 provides hours of stable stencil life, tack time and repeatable brick definition. SAC0307 robust printing characteristics result in consistent solder paste volume regardless of idle time, stencil life and print speed. The activator package in the SAC0307 is very aggressive and provides superior wetting to OSP coated and Immersion Silver boards. Generally used is type3 and type 4 powder.Read More

  • 227degree Tin-copper Solder Wire Sn99.3Cu0.7

    Contact Now227degree Tin-copper Solder Wire Sn99.3Cu0.7227degree tin-copper solder wire BBIEN LF-03 Sn99.3Cu0.7 BBIEN LF-03 Sn99.3Cu0.7 lead free soldering wire is based on a"No-Clean"flux and is available with lead-free alloy,its melting point is 227degree Celsius,can be used for repairing almost electronics,chips,pcb,lead free items.It has been developed for usual requirements for conventional soldering and for soldering in industrial production and for repair and resoldering.The smallest diameter size can be above 0.15mm(0.2mm,0.3mm,0.5mm,0.6mm,0.8mm,1.0mm,1.2mm,1.5mm,2.0mm…),packing with 100g,200g,250g,500g,1kg per spool.Read More

  • 0.1mm No-clean Flux Core Wire Solder Sn96.5Ag3.0Cu0.5

    Contact Now0.1mm No-clean Flux Core Wire Solder Sn96.5Ag3.0Cu0.5No-clean flux core wire solder 0.1mm to 3.0mm BBIEN LF-01 Sn96.5Ag3.0Cu0.5 BBIEN LF-01 Sn96.5Ag3.0Cu0.5 no clean flux core solder wire are both a halide-free and halogen type available,not water-soluble,flux cored and solid solder wire,melting point is 217 degree Celsius high temperature.BBIEN LF-01 Sn96.5Ag3.0Cu0.5 Pb free tin-silver solder wire is also belongs to RoHS standard wire solder,the diameter of this solder can be above 0.1mm(0.1mm~0.15mm),0.2mm,0.3mm…1,0mm…Read More

  • 183 Degree No Clean Lead Solder Paste Sn63Pb37

    Contact Now183 Degree No Clean Lead Solder Paste Sn63Pb37183 degree no clean lead solder paste BBIEN TL-01 Sn63Pb37 BBIEN TL-01 Sn63Pb37 no clean tin lead solder paste its melting point is 183 degree Celsius was developed to meet the demands of tin lead soldering when lead free components are present in the circuit assembly.Like all BBIEN solder pastes,SN63PB37 leaded solder paste has excellent print volume repeatability to minimize variation in the print process.SN63PB37 minimizes print cyle times through high print speeds and extended number of prints between stencils under cleaning.Naormal type 3 no clean solder paste is made for Sn63/Pb37,type4,type5,type6 and type7 lead contain solder paste are also available.Read More

  • No Clean Lead Free Silver Solder Wire Sn99Ag0.3Cu0.7

    Contact NowNo Clean Lead Free Silver Solder Wire Sn99Ag0.3Cu0.7No clean lead free silver solder wire BBIEN LF-02 Sn99Ag0.3Cu0.7 BBIEN LF-02 Sn99Ag0.3Cu0.7 flux core, no clean high temperature 227degree Celsius solder wire is a low residue flux core solder designed for hand soldering and to repair electronics applications. Sn99Ag0.3Cu0.7 flux core solder wire is a newly developed cored wire that is specifically designed to meet JIS Class AA requirements, with a halide content <1,000ppm, for no-clean lead-free applications.  It offers the balance of high SIR reliability and excellent spread characteristics.  It is among the best performing products in the our cored Wire product portfolio.  The pay off is not only an excellent soldering performance, but also a reliable material that is able to comply to IPC flux ROL1 classification.Read More

  • Mid Temperature Solder Paste Sn62Pb36Ag2

    Contact NowMid Temperature Solder Paste Sn62Pb36Ag2Middle temperature solder paste BBIEN TL-02 Sn62Pb36Ag2 BBIEN TL-02 leaded reflowing Pb solder paste Sn62Pb36Ag2 has been developed for the lead-containing SMD electronics manufacturing. This solder paste contains a highly active type ROL1 No-Clean flux. With a special composition for excellent wetting, it meets all requirements for good forming of solder joints. This No-Clean solder paste particularly displays its strengths on surfaces which are difficult to solder. The low amounts of residues after the reflow are light, transparent, electrically safe and do not have to be removed.Read More

  • Mid Temperature Solder Paste Sn64.7Bi35Ag0.3

    Contact NowMid Temperature Solder Paste Sn64.7Bi35Ag0.3Mid temperature solder paste LF-04 Sn64.7Bi35Ag0.3 To meet the demand of high-density and memory/logic options for sophisticated electronic devices, many assemblers are evaluating package on package (PoP) technology. PoP assemblies allow for higher electronic functionality per unit circuit board area, and allows low cost product memory customization, and highly flexible manufacturing. Unlike PoP flux, BBIEN LF-04 Sn64.7Bi35Ag0.3 solder paste uses flux and solder powder, to minimize defects associated with non-planar processor/memory combinations during the reflow process.Read More

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