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wave solde flux

  • Best Quality Tin-lead Wave Soldering Bar Sn63Pb37

    Contact NowBest Quality Tin-lead Wave Soldering Bar Sn63Pb37Best quality tin-lead wave soldering bar Sn63Pb37 BBIEN TL-01 Sn63/Pb37 leaded soldering bar is consist of 63%tin 37%lead,this soldering bar is manufactured using high purity raw materials and is treated using proprietary dross reducing technology to give a solder alloy that has Low Dross Characteristics. Sn63Pb37 wave solder bar can meet BBIEN's proprietary viscosity and dross lowering treatments.This results in a pure,low drossing,high fluidity solder alloy,which is free of cast-in impurities and included oxides. less tin dross and high purity high fluidity solder alloy of 63%Sn37%Pb tin lead alloy soldering bar the excellent welding result bar solders lead solder bar for wave soldering SMT PCB.Read More

  • SAC305 Lead Free Wave Silver Soldering Bar

    Contact NowSAC305 Lead Free Wave Silver Soldering BarSAC305 lead free wave silver soldering bar BBIEN LF-03 Sn96.5Ag3Cu0.5 and is lead-free alloys suitable for use as a replacement for Sn63Pb37 alloy.The SAC305 Sn-Ag-Cu series Pb-free wave silver solder bar/stick variants is used to stabilize/reduce the copper content in the wave solder bar;this requirement will depend on process conditions.As with all our metals bar solder,BBIEN’S proprietary alloying process is used to remove certain impurities,particularly oxides.Read More

  • Acid Pb Flux Core Solder Wire Sn55Pb45

    Contact NowAcid Pb Flux Core Solder Wire Sn55Pb45Acid Pb flux core solder wire Sn55Pb45 BBIEN TL-04 Sn55Pb45 RMA is a mildly activated,general-purpose wire solder for use in applications requiring good activation.RMA cored wire is active enough for excellent tarnish or oxide removal,and will produce bright shiny solder joints.RMA lead Sn-Pb solder wire will leave slight to moderate post-process residues that may be left on noncritical applications,but should be removed from any critical applications.RMA cored wire meets Mil-Spec cleanliness requirements without cleaning.IPC flux classification for this material is ROL0. Diameter above 0.3mm(0.5mm,0.8mm,1.0mm,1.5mm,2.0mm) Packing:100g,200g,250g,500g,1kg per spoolRead More

  • 0.1mm No-clean Flux Core Wire Solder Sn96.5Ag3.0Cu0.5

    Contact Now0.1mm No-clean Flux Core Wire Solder Sn96.5Ag3.0Cu0.5No-clean flux core wire solder 0.1mm to 3.0mm BBIEN LF-01 Sn96.5Ag3.0Cu0.5 BBIEN LF-01 Sn96.5Ag3.0Cu0.5 no clean flux core solder wire are both a halide-free and halogen type available,not water-soluble,flux cored and solid solder wire,melting point is 217 degree Celsius high temperature.BBIEN LF-01 Sn96.5Ag3.0Cu0.5 Pb free tin-silver solder wire is also belongs to RoHS standard wire solder,the diameter of this solder can be above 0.1mm(0.1mm~0.15mm),0.2mm,0.3mm…1,0mm…Read More

  • Liquid Solder Flux

    Contact NowLiquid Solder FluxLiquid solder flux BBIEN LF-01 liquid wave solder flux is activated rosin liquid flux is a homogeneous solution of high quality purified high grade rosin in a specially blended alcohol vehicle into which a very small amount of an extremely effective activating agent has been incorpo-rated.BBIEN LF-01 flux is classified as Type ROL1 flux under IPC ANSI/J-STD-004 Joint Industry Standard. BBIEN LF-01 is a high quality lead free solder flux,also a low solids,weak-halide,no-clean flux that is designed for wave solder,selective solder and touch up processes,it approved as type RMA and has proven to be nearly as active in fluxing ability as highly activated rosin fluxes,but the flux and its residue are considerably less conductive.The low conductivity results from a minimum of ionic activating agent as shown by the very high water extract resistivity.The rosin residue is non-corrosive,non-conductive,and moisture and fungus resistant.The dry rosin residue actually insulates the surface from atmospheric corrosion.General packing is 16kg/20l per drumRead More

  • BGA Tacky Solder Flux

    Contact NowBGA Tacky Solder FluxBGA tacky solder flux BBIEN tacky paste flux is available for a wide range of applications,including rework as well as flip chip attach and BGA/CSP ball attach.They may be applied by printing,dispensing,pin transfer and dipping.Spraying and foaming for selected products is possible.Our special tacky solder flux is based on both halogen-free and halogen type ball attach flux and a blend of fine powder to allow stencil and dispensing BGA manufacturers best possible yields. Packing: 1.For stencil screen printing technical using:100g per jar/can 2.For dispensing joint soldering technical using:10cc per syringe tube/cartridgeRead More

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