Dispensing SMT Red Glue Epibond Adhesives 30ml Tube

Dispensing SMT red glue epibond adhesives 30ml tube BBIEN dispensing SMT Epibond Surface Mount Adhesives also called Red viscous gel or resin SMT adhesive,can be removed from a printed circuit board by heating the board to approximately 80C(176F to 185oF).When the temperature of the surface mount component.Epibond®epoxy surface mount adhesives are formulated to meet the exacting performance and quality requirements of printed circuit board manufacturers.

Details

Product Details

Dispensing SMT red glue epibond adhesives 30ml tube

Description of dispensing epibond adhesives

BBIEN’s dispensing SMT red glueis a kind of single resin adhesive .Good stable curing shapes without stringing, overflowing and slumping are achieved even at a super high speed and long time printing. Because of the “rarely cutting” bonding strength and very low humidity absorption, it is specially fit for SMT technology of porous printing in common temperature. Its shape can easily be controlled .We can not only expect a long-term preservation stability but also the excellent thermal resistance and electrical properties. Moreover it is good for environment protection for its safety, no solvent and no smelling. 

Feature of BBIEN dispensing 30ml red glue adhesive

- For Dispensing Applications,Fast Curing and Non-Stringing Formula

- Good for High Speed Placement Equipment- High Shear Strength

- Available in Industry Standard Sizes; Non-REACH Compliant

· Dispense, print and pin transfer application.

· High-visibility red or yellow options.

· Room temperature stability, 6-month room temperature shelf life.

· Non slumping and non stringing.

· Screen printable with BBIEN CUT laser stencils to SMD adhesive guidelines.

BBIEN dispensing SMT surface mount adhesives offer excellent performance for all print and dispensing

· Non-slumping and non-stringing.

· Room temperature stability.

· Dispense, print and pin transfer application.

· Consistent dot profile and fact curing.

· High-visibility red or yellow options.

BBIEN dispensing Epibond Surface Mount Adhesives Typical Cure Profile

A correct thermal profile is critical to ensure that the adhesive achieves maximum mechanical strength and a homogeneous cure:

· Ensure the material is heated to the correct temperature for the specific time.

· maximum thermal ramp rate is 1.5 to 2.0°C/second to ensure a homogeneous cure.

Printed Adhesive

 

· Sales/support in every major electronics geographic market

· Local and consistent technical support regionally and globally

· Consistent product performance globally

Part of physical feature and specification

Products

Appearance

viscosity

Density

Shear Strength

Cure Temperature

Cure Speed

mPa.s

g/cm3

mpa

°C

s

Red Glue

Red

280,000mPa·S

(280,000cps)

1.31

14.6

105

120-150

l  Treating condition:85℃×85%RH×DC50V×1000hrs. 

l  JIS Z3197 Measured at comb electrode model II (G10) 

Specification:       


Technology

Epoxy

Chemical Type

Epoxy

Appearance (uncured)

Red viscous gel

Components

One component - requires no mixing

Cure

Heat Cure

Application

Surface Mount Adhesive

Key Substrates

Electronic components to printed circuit boards.

Other Application Areas

Small Parts Bonding

Dispense Method

Dispensing processing

Wet Strength

High

Dot Profile

Peaked                



Item

SMT Red Glue adhesive

 Composition

Epoxy resin adhesive

Appearance

Tacky Paste/red-colored

Specific gravity

1.31

Viscosity at 25℃,5rpm

280,000mPa·S(280,000cps)

Thixotropy index

6.8(1rpm/10rpm)

Adhesive Strength  2125C

Mini-mold tr

SOP·IC 16P                              

44N(4.5kgf)0.2mgr twin

45N(4.6kgf)0.3mgr twin

92N(9.4kgf)0.8mgf single×2

Electric Property

Volume resistance

Insulation resistance

Initial value

After treating*

Dielectric constant

Dielectric loss tangent

3.6×1016Ω·cm    JIS K6911

1.2×1014Ω        JIS Z3197

1.2×1012Ω             

3.12/1MHZ      JIS K6911

0.012/1MHZ     JIS K6911

Preservation condition

3℃~10℃的

To be strictly kept at 3℃ ~10℃ in refrigerator

Main content

Main Epoxy resin and some(adhesive agent,wetting agent and surfactant…

Package style for dispensing BBIEN SMT red glue adhesive

Package styles

Contents

Pack. Unit

Export outer packing

syringe packing

30ml

Pcs.

100pcs per carton

Features

1)Much lower temperature curing is aimed at amd is practically possible.

2)Very good stable curing shapes without stringing and slumping are achieved at super high speed dispensing and very amall dots.

3)stable adhesive strength can be obtained with a variety of SMD.

4)Long-term preservation stability is expected.

5)High heat-resistivity and excellent electric properties are possessed.

6)Usable for screen printing.

Direction for use 

1. After storage in a refrigerator the adhesive must be allowed to equilibrate to room temperature before use, typically 12 hours.

2. Avoid cross contamination with other epoxy or acrylic adhesives by ensuring dispense nozzels, adapters etc. are thoroughly cleaned.

3. The quantity of adhesive dispensed will depend on the dispense pressure, time, nozzle size and temperature.

4. These parameters will vary depending on the type of dispensing system use and should be optimized accordingly.

5. Bath temperature should ideally be controlled at a value between 25°C-30°C, 50%RH for optimum results. Under these conditions product will remain dispensable in the tray for at least 2 to 3 days.

6. Uncured adhesive can be cleaned from the board with isopropanol, MEK or glycol ether blends such as Prozon.

CURE SPEED VS. TEMPERATURE

The following graph shows the rate of torque strength developed with time at different temperatures. These times are defined from the moment the adhesive reaches cure temperature. In practice, total oven time may be longer to allow

for heat up period

Warning

○Products shelf life: 6Months.

○Store adhesive in a refrigerator keeping the temperature at 5±3℃ 

○This product may cause skin irritation to sensitive personnel.

○In case Seal-glo DTK-L978 gets in touch with skin,wash it thoroughly with soap and water.

○In case of eye contact,wash out with clean water and consult a medical doctor immediately.

REWORKING

Once cured,BBIEN dispensing epibond adhesives can be removed from a printed circuit board by heating the board to approximately 80°C (176°F to 185oF). When the temperature of the surface mount component reaches 80°C (176°F), the adhesive will be soft enough to permit component removal using a "lift and twist" method.

CLEANING

Uncured adhesives can be easily removed from printed circuit boards, screens or stencils using,isopropyl alcohol, acetone, NMP and a wide variety of other solvents and cleaning fluids. BBIEN Advanced Materials is constantly working with manufacturers of solvents and cleaning fluids to test and identify new materials that meet the needs of our customers. For an updated list of suggested cleaning materials

Application :component epoxy resin adhesives

Epoxy 1-component adhesives are heat curing and primarily used when high shear strength or high crash-resistance is required, as well as ease of working.
Note:Curing  conditionnt

Recommended curing condition:Over 60 sec after PCB’s surface temperature has reached 150℃.or over 90 sec after PCB’s surface temperature has reached 120℃.
When the higher curing temperature and the longer curing time,the stronger adhesive strength can obtained.We would suggest you to search out an optimum curing condition,for the temperature exerterd on the adhesive may occasionally vary according to the size,material,etc.of component parts mounted on PCBs.

Curing condition

○Recommended curing condition: Over 60 sec after PCB’s surface temperature has reached 150℃.or over 90 sec after PCB’s surface temperature has reached 120℃.

○When the higher curing temperature and the longer curing time, the stronger adhesive strength can obtained. We would suggest you to search out an optimum curing condition, for the temperature is different on the adhesive may occasionally vary according to the size,material,etc.of component parts mounted on PCBs.

How to use Red glue adhesive

○Adhesive should be preserved in refrigerator (below 5±3℃) to keep on its quality.

○Before processing, the adhesive should be taken out from the refrigerator for de-freezing about a few hours until it reaching the room temperature.

○The bottom of printing screen should be cleaned timely for good printing shape.

○Toluene or ethyl acetate is possible to use for cleaning up this adhesive.

Health & Safety:

This product, during handling or use, may be hazardous to health or the environment. Read the Material safety Data Sheet and warning label before using this product.

Consult the MSDS for all safety information. The most recent version of the SDS is available from BBIEN.Inhalation of the flux solvent and volatilized activator fumes, which are generated at soldering temperatures, may cause headaches, dizziness and nausea. Suitable fume extraction equipment should be used to remove the flux from the work area. An exhaust at the exit end of the wave solder machine may also be needed to completely capture the fumes. Observe precautions during handling and use.

Suitable protective clothing should be worn to prevent the material from coming in contact with skin and eyes.

Exported countries:

Our SMT red glue adhesive have been exported to Iran,Korea, Turkey,America,Morocco,... We are appreciated your kindly inquiry or cooperate with you,if you are interested in our products.

Products Photos

BBIEN Technology is one of the professional manufacturers and suppliers of dispensing smt red glue epibond adhesives 30ml tube. We have professional workers who have consummate skills producing high quality products in our factory. Welcome to buy our discount and low price dispensing smt red glue epibond adhesives 30ml tube made in China. Pricelist and quotation consultation are available if you need.

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