Type5 Sn42Bi57.7Ag0.3 Low Temperature Solder Powder

Type5 Sn42Bi57.7Ag0.3 low temperature solder powder BBIENT Technology allows us to produce perfectly sized,low oxide solder powders for Sn-Bi-Ag series alloy powder,Sn42Bi57.7Ag0.3 is low melting point solder powder with appox 138~152degree Celsius as liquid temperature.All BBIEN solder powders are atomized in a controlled atmosphere to minimize oxygen content.BBIEN’s proprietary separation process ensures perfectly sized powder without surface damage.The particle size distributions exceed the specification and contain no fines below 15 microns(Types 2.3,3,4,5.6.7).

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Details

Product Details

BBIEN LF-03 type5 Sn42Bi57.7Ag0.3 low temperature solder powder

BBIEN Solder Powder

Solder powders are the key component of all solder pastes.Pastes made with the same flux but with powders that differ in particle sizes often have different rheological/physical properties resulting in differences in screen/stencil printing,component placement and production yields.The powder constituent of solder paste,in fact,affects all stages of surface mount assembly from stability and printability of the paste,to the quality of the final fillet.BBIEN’s LF-03 type4 and type5 Sn42Bi57.7Ag0.3 solder powder is produced using only the highest quality virgin materials.All our powders exceed the J-STD-006 specification

Sn42Bi57.7Ag0.3 Solder powder feature

BBIEN low temperature Sn-Bi-Ag series solder powder products adopted:
(1)We take Strictly alloy material manufacturing process,raw alloy materials had been fully homogenized.before automization.

(2)Controlled by computer atomization technology process,It is ensured the solder powder from atomization atmosphere to have consistency and stability of quality.
(3)The oxidation rate of Solder powder has been strictly controlled,It is made the total oxygen content below the Japanese industrial standard range,and the use of special surface packaging technology make solder powder surface form thin and strong protective film.

Advantage for Sn-Bi-Ag solder powder

1) The Sn42Bi57.7Ag0.3 solder powder is ball shaped,the dark part is a tin rich area and the light part is a lead rich area.The pictures show the good sphericity,homogenous alloy composition and smooth surface of the product.

2) Even particle size distribution:Particle size classification and final typing technology enables stable particle size of the product provided to customers.

3) Low oxygen content:Oxygen content is strictly controlled during production and packing of allalloy welding powder.Leco oxygen determinator is adopted to determine the surface oxygen content and chemical assay is adopted to determine the total oxygen content.

Particles

The Surface oxygen content

The total oxygen content

Type2(45-75um)

≤120ppm

≤0.08%

Type2.3(38-63um)

≤120ppm

≤0.08%

Type3(25-45um)

≤120ppm

≤0.08%

Type4(20-38um)

≤120ppm

≤0.1%

Type5(15-25um)

≤180ppm

≤0.15%

Storage,Handling,and Shelf Life:

Recommended optimum storage condition for solder powder to maintain consistent viscosity,reflow characteristics ,and overall performance.BBIEN’S Sn42Bi57.7Ag0.3 should be stabilized at room temperature prior to printing.BBIEN Sn42Bi57.7Ag0.3 solder powder should be kept at standard refrigeration temperatures,20~28°C.Please contact BBIEN,if you require additional advice with regard to storage and handling of this material.Shelf life is 6months from date of manufacture and held at 20~28°C

Particle size for Sn-Bi-Ag series powder

Grade

1%Less Than

90%

10%Max.

Type 3

+45 microns

25-45 micron(µm)

25 microns(µm)

Type 4

+38 microns

20-38 micron(µm)

20 microns(µm)

Type 5

+25 microns

15-25 micron(µm)

20 microns(µm)

Type 6

+18 microns

10-18 micron(µm)

10 microns(µm)

Type 7

+25 microns

5-12 micron(µm)

5 microns(µm)

Type4~type7

<120 ppm microns

Technical datasheet of Sn42Bi57.7Ag0.3 solder powder

Specification

Sn42Bi35.7Ag0.3-type4,type5 powder

Appearance

Gray/black small size of powder on surface

Packing

General 5kg/bag;

Chemistry component(Test Method:Titration Analysis+Spectrum Analysis)

Elements Specification(%)Max Tested result(%WT)

Sn 42.0±0.5 41.7709

Al≤0.001 0.0001

As≤0.030 0.0025

Sb≤0.050 0.0020

Bi Bal Bal

Cu≤0.080 0.0004

Fe≤0.020 0.0006

Zn≤0.001 0.0004

Ni≤0.010 0.0003

Pb≤0.050 0.0257

Cd≤0.002 0.0002

Au≤0.050 0.0001

Ag 0.2~0.4 0.3979

Cd≤0.0020 0.0004

Ge≤0.050 0.0003

Mark:Storage at the room temperature≤25°C,humidity≤50%RH,Expiration date:6months

Impulse Calefaction And Testing With Microscope

Oxygen Content:standard<0.0150,result is 0.0091;

Shape:>90%(ANSI/J-STD-005 Spherical)

Powder size Percentage:

>45μm

<0.0

0.00

Analysis Method

38~45μm

<1.0

0.75

PSD Analysis

25~38μm

20~25μm


59.06

40.19

<20μm

<10.0

0.00

BBIEN's solder powder as follow


Alloy component

Melting

point℃

SuggestingWorking temperature℃

Gravity g/cm3

Rigidity HB

Conduct heat

M.S.K

Extend

Mpa

Extend

rate

%

Conductivity%

Sn42Bi58

138~145

100~250

8.77

11.6

65

33

Above 80

16.6



SN

Alloy Brand

Solidus Temperature

Liquidus Temperature

Density g/cm3

Available type size

1

Sn42Bi58

139

139

8.8

Type3~type7

2

Sn64Bi35Ag1

151

172

8.2

Type3~type7

3

Sn64.7Bi35Ag0.3

151-152

172-173

8.1

Type3~type7

4

Sn42Bi57.7Ag0.3

143-152

152-165

8.3

Type3~type5

5

Sn96.5Ag3.0Cu0.5

217

210-220

7.54

Type3~type7

6

Sn99Ag0.3Cu0.7

227

220-230

7.43

Type3~type7

7

Sn63Pb37

183

180-190

8.4

Type3~type7

8

Sn62Pb36Ag2

179

170-183

8.62

Type3~type7

Exported countries:

South Korea,Russia,America,Mid-east countries,Brazial,India,Thailand.

Products Photos

BBIEN Technology is one of the professional manufacturers and suppliers of type5 sn42bi57.7ag0.3 low temperature solder powder. We have professional workers who have consummate skills producing high quality products in our factory. Welcome to buy our discount and low price type5 sn42bi57.7ag0.3 low temperature solder powder made in China. Pricelist and quotation consultation are available if you need.

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