BBIEN LF-03 type5 Sn42Bi57.7Ag0.3 low temperature solder powder
BBIEN Solder Powder
Solder powders are the key component of all solder pastes.Pastes made with the same flux but with powders that differ in particle sizes often have different rheological/physical properties resulting in differences in screen/stencil printing,component placement and production yields.The powder constituent of solder paste,in fact,affects all stages of surface mount assembly from stability and printability of the paste,to the quality of the final fillet.BBIEN’s LF-03 type4 and type5 Sn42Bi57.7Ag0.3 solder powder is produced using only the highest quality virgin materials.All our powders exceed the J-STD-006 specification
Sn42Bi57.7Ag0.3 Solder powder feature
BBIEN low temperature Sn-Bi-Ag series solder powder products adopted:
(1)We take Strictly alloy material manufacturing process,raw alloy materials had been fully homogenized.before automization.
(2)Controlled by computer atomization technology process,It is ensured the solder powder from atomization atmosphere to have consistency and stability of quality.
(3)The oxidation rate of Solder powder has been strictly controlled,It is made the total oxygen content below the Japanese industrial standard range,and the use of special surface packaging technology make solder powder surface form thin and strong protective film.
Advantage for Sn-Bi-Ag solder powder
1) The Sn42Bi57.7Ag0.3 solder powder is ball shaped,the dark part is a tin rich area and the light part is a lead rich area.The pictures show the good sphericity,homogenous alloy composition and smooth surface of the product.
2) Even particle size distribution:Particle size classification and final typing technology enables stable particle size of the product provided to customers.
3) Low oxygen content:Oxygen content is strictly controlled during production and packing of allalloy welding powder.Leco oxygen determinator is adopted to determine the surface oxygen content and chemical assay is adopted to determine the total oxygen content.
The Surface oxygen content
The total oxygen content
Storage,Handling,and Shelf Life:
Recommended optimum storage condition for solder powder to maintain consistent viscosity,reflow characteristics ,and overall performance.BBIEN’S Sn42Bi57.7Ag0.3 should be stabilized at room temperature prior to printing.BBIEN Sn42Bi57.7Ag0.3 solder powder should be kept at standard refrigeration temperatures,20~28°C.Please contact BBIEN,if you require additional advice with regard to storage and handling of this material.Shelf life is 6months from date of manufacture and held at 20~28°C
Particle size for Sn-Bi-Ag series powder
<120 ppm microns
Technical datasheet of Sn42Bi57.7Ag0.3 solder powder
Gray/black small size of powder on surface
Chemistry component(Test Method:Titration Analysis+Spectrum Analysis)
Elements Specification(%)Max Tested result(%WT)
Sn 42.0±0.5 41.7709
Bi Bal Bal
Ag 0.2~0.4 0.3979
Mark:Storage at the room temperature≤25°C，humidity≤50%RH,Expiration date:6months
Impulse Calefaction And Testing With Microscope
Oxygen Content:standard<0.0150,result is 0.0091;
Powder size Percentage:
BBIEN's solder powder as follow
Available type size
South Korea,Russia,America,Mid-east countries,Brazial,India,Thailand.
BBIEN Technology is one of the professional manufacturers and suppliers of type5 sn42bi57.7ag0.3 low temperature solder powder. We have professional workers who have consummate skills producing high quality products in our factory. Welcome to buy our discount and low price type5 sn42bi57.7ag0.3 low temperature solder powder made in China. Pricelist and quotation consultation are available if you need.