0.1mm No-clean Flux Core Wire Solder Sn96.5Ag3.0Cu0.5

No-clean flux core wire solder 0.1mm to 3.0mm BBIEN LF-01 Sn96.5Ag3.0Cu0.5 BBIEN LF-01 Sn96.5Ag3.0Cu0.5 no clean flux core solder wire are both a halide-free and halogen type available,not water-soluble,flux cored and solid solder wire,melting point is 217 degree Celsius high temperature.BBIEN LF-01 Sn96.5Ag3.0Cu0.5 Pb free tin-silver solder wire is also belongs to RoHS standard wire solder,the diameter of this solder can be above 0.1mm(0.1mm~0.15mm),0.2mm,0.3mm…1,0mm…

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Details

Product Details

No-clean flux core wire solder 0.1mm~3.0mm BBIEN LF-01 Sn96.5Ag3.0Cu0.5

Brief Introduction for LF-01 Sn96.5Ag3.0Cu0.5 solder wire

The solder wire LF-01 Sn96.5Ag3.0Cu0.5 is tin based lead freeno clean solder wire,it is a new development for automated,robotized and manual high tech soldering.Its very low flux spitting guaranties a minimum of equipment cleaning while increasing the soldering quality.The solder wire flux is based on a halide activated synthetic resin composition,which ensures his good wetting properties.

Soldering Advantage

Its clear residue allows easy inspection of solder joints and the very low spatter rate ensures board cosmetics and user comfort are maintained.All this translates to a safe and environmentally compliant product that is operator friendly while maintaining high levels of productivity.

BBIEN LF-01 Sn96.5Ag3.0Cu0.5 made 0.1mm~3.0mm no clean soldering wire is recommended for use in any hand soldering application where high flux activity is desired.

It was developed to provide superior wetting performance for hand soldering in the

electronics industry.The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes.The use of LF-01 silver solder wire results in an extremely clear post-soldering residue without cleaning.The unique chemistry in Sn96.5Ag3.0Cu0.5 was also designed to reduce spattering common to most core fluxes.Sn96.5Ag3.0Cu0.5 can be used for both leadbearing and lead-free soldering.

Application

The BBIEN LF-01 Sn96.5Ag3.0Cu0.5 Pb free solder wire is suitable for both manual and machine soldering of electrical and electronic components.The flux residues do not need to be removed.

Sn96.5Ag3.0Cu0.5 lead free no clean solder wire is specifies compliance to the IPC J-STD-004B ROL0 standard.It is ideal for electronic assemblies used in tomotive,Consumer Electronics,Computer and peripherals,Mobile devices and all types of Au household appliance applications.As well as apply to High-precision medical instrumentation.

Application notes

Use a soldering iron tip size and form to suit the operation:

small tips for soldering large components may prevent the formation of a joint or slow the process down.

Select a solder wire diameter to suit both the soldering iron tip and the parts/components to be soldered.

Soldering iron systems should provide sufficient heat to satisfy the requirements of the points above.A typical solder tip temperature would be between 215°C and 235°C above the liquidus temperature of the alloy.

The ideal temperature to use is depend on how thermally demanding the assembly is.Cored solder wires can be provided in different grades of alloy so always ensures that you have selected the right gradefor the application.

Feature of Sn96.5Ag3.0Cu0.5 soldering wire

High temperature anti-oxygen satisfactory soldering joint and favorable fluidity.Solder joints are filled,and firm.Both RA and RMA are made in compliance with IPC J-STD-006 and JIS Z3283 class AA standards.All these solder flux can be dissolved in solvent,featuring a little smoke and very few splatters.

Diameter:above 0.1mm(0.1mm,0.2mm,0.3mm,0.4mm,0.5mm,0.8mm,1.0mm…)

Very fast wetting;Very low flux spatter

Good spread characteristics

Very low levels of fumes

Clear non-tacky residue

Provides good joint appearance

Halogen and Halide Free

Performance Characteristics:

Colorless translucent residues

Improves wetting performance

Excellent solderability and fast wetting to a variety of surface finishes

Eliminates the need and expense of cleaning

Low smoke and odor

Low spattering

Compatible with leaded and lead-free alloys

Classified as ROL0 per J-STD-004

Compliant to Bellcore GR-78

96.5Ag3.0Cu0.5(SAC305)soldering wire is low tendency of spitting,transparent residues and high thermal capacity,it produces very clean solder joints.As there is nearly no spitting,your soldering machine requires less servicing and you will have less shutdown periods.

Availability

Sn96.5Ag3.0Cu0.5 lead free silver soldering wire is available in a wide variety of types and sizes.

1. Flux core type of solder wire and no flux core(solid)type of solder wire

2. No clean type of silver solder wire

3. Halogen-free type of solder wire and haloids type of solder wire.

4. Acid type of solder wire

5. 0.1mm ultrafine solder wire

6. Many sizes of 0.15mm,0.2mm,0.3mm,0.5mm…3.0mm solder wires are all available

Flux core percentage are1.1%,2.2%and 3.3%.

Packing size

The tin solder wire could be classified as reel packing and tube packing type.
Each spool/roll holds the solder wire is 500g;
Each tube can load the solder wire is 13g/piece
Packing:

Specification

core solder wire/solid wire

Appearance

Bright alloy appearance

Packing

50g,100g,200g,250g,500g 500g,1kg,2kg per reel/bobbin;10kg/carton:40kg/carton

Tube packing:13g/tube

Size of 10kg carton:36x18x8cm

Size of 30kg carton:36x18x26cm

Cleaning

BBIEN LF-01 SAC305 Pb free solder wire’s flux residues are non-corrosive,non-conductive and do not require removal in most applications.IPA will not clean the residues off the surface of the circuit board after the soldering process.

Storage and Shelf Life

The shelf life of NNIEN LF-01 Sn96.5Ag3.0Cu0.5 no clean solder wire is based on the chemistry of the flux core and the protective alloy covering of the wire.

When stored in a dry,non-corrosive environment between 10°C-40°C(50-104°F),the shelf life of wire may be nearly

Flux-cored solder wires alloys have a 1-3 year warranty from the date of manufacture.

Over time,the surface of wire may lose its shine and appear a dull shade of gray.This is a surface phenomenon and is not detrimental to product functionality.

Exported Countries

Until now,BBIEN’S LF-01 Sn96.5Ag3.0Cu0.5 lead free no clean silver solder wire have been exported to many countries,e.g.America,South Korea,Japan,France,Germany…We are appreciated you are the next clients/cooperator with BBIEN.

Other information

Payment generally with T/T;L/C at sight is acceptable,Western Union and Paypal are also available.

OEM logo can be discussed with MOQ.

Delivery time:within 7working days after confirming payment if quantity bellowing 10 tons

Production ability:more than 80tons each month for normal diameter above 1.0mm,1kg/spool.Other sizes please contact BBIEN.

Certificate:SGS,ISO9001:2008;RoHS,REACH

Technical Datasheet

No-clean flux core wire solder BBIEN LF-01 Sn96.5Ag3.0Cu0.5

Specification Data

Product Type

Solder wire Sn96.5Ag3.0Cu0.5

Brand

BBIEN

Material

Tin-Silver-Copper alloy

Composition

Sn,Ag,Cu

Melt point

217degree

Flux content

1.5%,2.0%,3.0%or no flux

Application

Metal soldering,electronics

Density(g/m^3)

8.3

Diameter

0.1mm,0.2mm,0.3mm,0.4mm,0.5mm,0.7mm,0.8mm,1.0mm,1.2mm,1.5mm.2.0mm.3.0mm

Weight

1000g/pcs,500g/reel,250g/roll;100g,50g

Type

No clean Pb free solder wire

Place of origin

Guang dong,China

Certificate

SGS

Keyword

Tin silver copper lead free solder wire

Solder wire;no clean solder

Solder

Packing Details Information

Specification

core solder wire/solid wire

Appearance

Bright alloy appearance

Packing

50g,100g,200g,250g,500g 500g,1kg,2kg per reel/bobbion;10kg/carton:30kg/carton

Tube packing:13g/tube

Size of 10kg carton:36x18x8cm

Size of 30kg carton:36x18x26cm

50g/roll:240rools/export carton:G.W-14kg;Size of Carton:36*26*18cm

100g/roll:120rolls/export carton:G.W-13.5kg Size of Carton:36*26*18cm

200g/roll:120rolls/export carton:G.W-26.5kg Size of Carton:36*26*18cm

500g/roll:51/rolls export carton:G.W-27.5kg Size of Carton:36*26*18cm

1kg/roll:40rolls/export carton:G.W-41.5kg Size of Carton:36*26*18cm

Specification and chemistry component

Specification

Sn99-Ag3.0-Cu0.5

Appearance

Lucent,no dirt on wire surface

Chemistry component

Sn

Ag

Cu

Pb

Sb

Bi

Zn

Fe

Al

As

Cd

96.5

3.0

0.5±0.2

<0.01

<0.02

<0.01

<0.003

<0.02

<0.001

<0.03

<0.002

Physical Characteristic

Alloy component

Melting point

Proposion g/cm3

Rigidity HB

 

Conduct heat

M.S.K

Extend

Mpa

Extend

rate

%

Conductivity%

Sn96.5Ag3.0Cu0.5

217

7.4

9

64

32

48

16.0

Advantage And Service

0.1mm no-clean flux core wire solder BBIEN LF-01 Sn96.5Ag3.0Cu0.5

Products Advantage

.BBIEN is specialized in soldering industry from 2000, known as a experienced tin lead and lead free solder wire manufacturer, whose products are made in China,since then,BBIEN pays high attention to Research and Development,continuous technical innovation for pb and pb free solder wire industry,until now,we accumulate much valuable experience,five senior solder wire engineers operate a specialized reflowing solder wire production.

High temperature no clean solder wire TL-01 BBIEN Sn96.5Ag3.0Cu0.5 offers excellent solderbility,wettibility and reliability among leaded Pb contained solder wire, it is available in a wide product lineup according to the required soldering temperature.

Due to sophisticated technical in Sn-Ag-Cu alloy,BBIEN can supply the thinnest diameter size to 0.1mm for TL-01 BBIEN SAC305,SAC0307,SnCu0.7 no clean solder wire, normal size such as 0.2mm, 0.3mm, 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm,2.0mm solder wires are all available.

TL-01 BBIEN SAC305 tin-silver-copper no clean solder wire can be not only applied to tradional electronics pcb,electronics soldering,but also its application for some new hi-tech industry, semiconductor. LED, aerospace, automotive.

BBIEN TL-01Sn96.5Ag3.0Cu0.5 (SAC305) high temperature 217 degree Celsius RoHS standard soldering wire can be packaged with spool ,general 500g,1000g which is used for both hands soldering and air soldering technique;it can also be packed with 15g tube,name tube soldering wire.

Thanks to BBIEN long-term unremitting R&D for solder technique,until now,BBIEN have the following high-tech solder product for different lead free alloy.

No clean lead-free solder

melting point °C

Tensile strength

elongation reat%

expansion rate%

Diameter

Application

Solder wire alloy

Solder bar/block alloy

Solder paste alloy

Solder powder alloy

Sn99.3Cu0.7

227

30

45

70

≥0.1mm

low cost, the most commonly used;
Lead-free solder for general welding

yes

yes

yes

yes

Sn96.5Ag3.0Cu0.5

217

40

58

78

≥0.1mm

high cost, relatively bright spot;

high performence

Can be excellent for demanding welding
 

yes

yes

yes

yes


Sn99.0Ag0.3Cu0.7

Sn64Bi35Ag1

189

40

50

70


SMT,PCB

yes

not

yes

yes

Sn62Pb36Ag2

189

38

54

75


SMT,PCB

yes

not

yes

yes

Sn42Bi58

138

38

50

75

≥0.5mm

High cost

yes

not

yes

yes

Shipping Advantage

Mutiple-transportation oversea shipping ways by ari,by sea,by train and truck road way ensuring the shipment can arrive at destination all around the world safety,quickly and efficiently.

Shipment can be deliveried once placing order 2 to 10 working days.

Shipment will be regular go through local custom and its warehouse,BBIEN has own specialized shipping team and operators agent all over the world.

Technical Advantage

BBIEN can share the datasheet for our product to our clients.

Certificates of compliance,SGS,ISO and COA,MSDS,are available.

We are tyring to make our product quality system more and more complete,BBIEN also appreciate your precious suggestion.

Both pre-sale and after-sale,BBIEN have skilled person to follow-up our client,reply answer for reasonable price,relevant quality standard,products data informations,shipping for your questions skillfully, quickly, technical support is available.

Service

When you send us message,BBIEN will feedback you general within 2 working hours.Our customer service or sales person will be match with you above 10-24hours.And solve your problem on solder products.

OEM is available according to your own logo.

Return back to society

BBIEN also participates public benefit activities,return back to society.We support and want to create a environmental friendly society together with people.We also try our best to help someone who need us.

Payment way:

A variety and flexible of payment terms,T/T,western union,paypal,L/C can be acceptable.

BBIEN Technology is one of the professional manufacturers and suppliers of 0.1mm no-clean flux core wire solder sn96.5ag3.0cu0.5. We have professional workers who have consummate skills producing high quality products in our factory. Welcome to buy our discount and low price 0.1mm no-clean flux core wire solder sn96.5ag3.0cu0.5 made in China. Pricelist and quotation consultation are available if you need.

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