Pure Tin 99.95% Solder Wire Sn99.95

Product Details Pure tin 99.95%solder wire Sn99.95 Product Introduction BBIEN environmental pure solder wire LF-06 Sn99.95 is developed to comply with the IEC and JPCA halogen content specifications,complying with the recent trend for environmental protection.LF-06 Sn99.95 lead free solder wire...

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Details

Product Details

Pure tin 99.95%solder wire Sn99.95

Product Introduction

BBIEN environmental pure solder wire LF-06 Sn99.95 is developed to comply with the IEC and JPCA halogen content specifications,complying with the recent trend for environmental protection.LF-06 Sn99.95 lead free solder wire also apply for the highest industry standards for electro-chemical electonics.

Diameter of pure tin solder wire Sn99.95 is 0.8mm and 1.0mm,packing 1kg/spool.

Feature

BBIEN is willing to work with you in good relationships to refine the performance lead-free solder.
1)Little impurity,diffusion capacity well
2)Weldability,good fatigue resistance
3)Solder joints,solder surface brightness,good wetting
4)strong antioxidant,anti-creep
5)Increase production speed,reduce production costs

Sn99.95 pure tin solder wire is no flux core type and no clean,reliability and is very fast wetting with low flux spatter,setting the new standard in performance and reliability.Its clear non-tacky residue does not require cleaning,and its excellent joint appearance allows for easy inspection also generates a low amount of fumes,thus creating a clean and operator friendly working environment.

Production Specification

Product Type

Solder wire Sn99.95

Brand

BBIEN

Material

Pure tin solder wire

Composition

99.95%tin

Melt point

227 degree Celsius

Flux content

no flux

Application

Metal soldering,electronics

Density(g/m^3)

7.4

Diameter

1.0mm,,2.0mm

Packing

500g/spool,1kg/spool

Type

no flux core solder wire;no clean type

Place of origin

Made in China,Shenzhen City

Keyword

Pure tin soldering wire Sn99.95

Tin wire,pure tin wire,tin99.95%solder wire

Pure tin

Application:
The increased function of personal electronic devices,such as mobile phones and personal music devices,has driven the need for smaller and smaller active and passive components.This trend toward miniaturization,occurring at the same time as the conversion to RoHS-compliant BBIEN LF-06 pure tin lead-free solder wire assembly,has been a considerable challenge to the electronics assembly industry.The main reason for this is the higher reflow process temperatures required for Pb-free assembly.These higher temperatures can thermally damage the PCB and the components.In addition,the higher reflow temperatures can negatively affect the solder joint quality,especially when coupled with the smaller paste deposits required for these smaller components.If additional thermal processing is required,the risk increases even more.

BBIEN Technology is one of the professional manufacturers and suppliers of pure tin 99.95% solder wire sn99.95. We have professional workers who have consummate skills producing high quality products in our factory. Welcome to buy our discount and low price pure tin 99.95% solder wire sn99.95 made in China. Pricelist and quotation consultation are available if you need.

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